Harris Corporation

Arthur Wilson

Michael Raymond Weatherspoon

Lawrence Wayne Shacklette

Joshua P Bruckmeyer

Digital data system disposed on a substrate includes a digital data device and at least one digital data interconnect disposed on the substrate. The digital data interconnect is comprised of a plurality of material layers stacked to form a three-dimensional structure. The material layers form a conductive shield, a plurality of straps which are periodically spaced along an interior length of the shield, and a core which includes one or more conductors. The conductors extends along the length of the tubular form parallel to the opposing walls and are suspended on the straps, separated from the conductive shield by an air gap. First and second conductors of the core can facilitate a differential signaling mode.

Digital data device interconnects

Systems () and methods () for providing a compliant micro-coaxial interconnect with an integrated circuit or other electronic device. The methods comprise: forming a well () in a first substrate () having a first Coefficient of Thermal Expansion ('CTE'); forming at least one three-dimensional micro-coaxial interconnect () on the first substrate so as to have a cantilevered end portion () disposed over the well; and using a first coupler () to electrically couple the cantilevered end portion to a second substrate () having a second CTE different from the first CTE. The cantilevered end portion has an angled joint () so that at least one of a pushing force and a pulling force applied thereby to the first coupler is minimized when mismatching movements of the first and second substrates occur.

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W. Melbourne, FL, United States of America

Arthur Wilson