Materion Gmbh

Arthur V Testanero

Xingbo Yang

Matthew J Komertz

Dejan Stojakovic

Longzhou Ma

Processes for refurbishing a spent sputtering target with a non-circular shape are disclosed. In one form, the processes include the steps of receiving one or more spent sputtering targets, inspecting and weighing the spent sputtering targets, removing any contaminants or other surface impurities from the spent sputtering target surfaces, preparing a hot press die with spacers, disposing the spent sputtering targets in the hot press die, the spacers used to center the spent sputtering targets therein, loading fresh metal refilling powder into the die to account for depleted regions of the spent sputtering targets to produce a powder-filled sputtering target, and applying sufficient heat and force to the filled sputtering target to produce a refurbished sputtering target with homogeneous composition and sufficient adhesion strength.

Processes for refurbishing a spent sputtering target

Methods for making a high purity (&#x3e;99.99%) and low oxygen (&#x3c;40 ppm) sputtering target containing Co, CoFe, CoNi, CoMn, CoFeX (X=B, C, Al), Fe, FeNi, or Ni alloys with a column microstructure framed by boron intermetallics are disclosed. The sputtering target is made by directional casting a molten mixture of the metal alloy, annealing to remove residual stresses, slicing, and optional annealing and finishing to obtain the sputtering target.

Cobalt, iron, boron, and/or nickel alloy-containing articles and methods for making same

Methods for finishing a sputtering target to reduce particulation and to reduce burn-in time are disclosed. The surface of the unfinished sputtering target is blasted with beads to remove machining-induced defects. Additional post-processing steps include dust blowing-off, surface wiping, dry ice blasting, removing moisture using hot air gun, and annealing, resulting in a homogeneous, ultra-clean, residual-stress-free, hydrocarbon chemicals-free surface.

Methods for surface preparation of sputtering target

Methods for making a high purity (&#x3e;99.99%) and low oxygen (&#x3c;40 ppm) sputtering target containing Co, CoFe, CoNi, CoMn, CoFeX (X&#x2550;B, C, Al), Fe, FeNi, or Ni alloys with a column microstructure framed by boron intermetallics are disclosed. The sputtering target is made by directional casting a molten mixture of the metal alloy, annealing to remove residual stresses, slicing, and optional annealing and finishing to obtain the sputtering target.

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New Fairfield, CT, United States of America

Arthur V Testanero