Deringer-ney, Inc.

The J. M. Ney Company

Arthur S Klein

Edward F Smith

Srinath Viswanathan

Peter Hale

Edward F Iii Smith

Palladium-based ternary or higher alloys include palladium at about 45-55 wt %, copper about 32-42 wt %, silver at about 8-15 wt %, rhenium at about 0-5 wt %, and optionally one or more modifying elements at up to 1.0 wt %. The alloys are age-hardenable, provide hardness in excess of 350 HK (Knoop, 100 g load), have electrical conductivities above 19.5% IACS (International Annealed Copper Standard), have an elevated temperature strength above 100 ksi at temperatures up to 480&#xb0; F. (250&#xb0; C.), and remain ductile (tensile elongation&#x3e;2%) in their fully age-hardened condition. The alloys may be used in static and moveable electrical contact and probe applications.

Palladium-based alloys

Palladium-based ternary or higher alloys include palladium at about 45-55 wt %, copper about 32-42 wt %, silver at about 8-15 wt %, rhenium at about 0-5 wt %, and optionally one or more modifying elements at up to 1.0 wt %. The alloys are age-hardenable, provide hardness in excess of 350 HK (Knoop, 100 g load), have electrical conductivities above 19.5% IACS (International Annealed Copper Standard), have an elevated temperature strength above 100 ksi at temperatures up to 480&#xb0; F. (250&#xb0; C.), and remain ductile (tensile elongation &#x3e;2%) in their fully age-hardened condition. The alloys may be used in static and moveable electrical contact and probe applications.

Apparatuses and methods for fuel level sensing are described herein. An example sensor may include a sealed housing and an electrically conductive coil. The sealed housing may comprise a pivot end, a float end opposite the pivot end, and an interior defined by walls extending therebetween. The pivot end may be adapted to join a pivot point and the float end may be adapted to join to a float at an exterior of the housing. The electrically conductive coil spring is disposed in the housing interior and comprises a first end and a second end opposite the first end. The coil spring is adapted to expand and retract in response to movement of the internal float within the housing and to electrically couple to a circuit configured to sense a change in resistance in the coil spring in response to expansion and retraction of windings of the coil spring.

Apparatuses and methods for fuel level sensing

Apparatuses and methods for fuel level sensing are described herein. An example sensor includes a sealed housing comprising a first end, a second end, and an interior defined by walls extending therebetween. The sensor includes a float surrounding an exterior of the sealed housing and is configured to move longitudinally along the sealed housing between the first end second ends. The float may include a magnetic element configured to provide a magnetic field. The sealed housing may include an electrically conductive spring coupled to at least one of the first end or the second end, and may include a ferrous element coupled to the electrically conductive spring and configured to be displaced relative to the sealed housing based on the magnetic field. The electrically conductive spring may expand and retract to adjust a resistance of the electrically conductive spring in response to the ferrous element being displaced.

Ultra-low magnetic susceptibility, biocompatible palladium-tin, palladium-aluminum, and palladium-tantalum alloys include at least 75 at % palladium, between about 3 and 20 at % tin, aluminum, or tantalum, respectively, and one or more other additives chosen from niobium, tungsten, molybdenum, zirconium, titanium, tin for non-palladium-tin alloys, aluminum for non-palladium-aluminum alloys, or tantalum for non-palladium-tantalum alloys, up to about 22 at % total.

Palladium-based alloys for use in the body and suitable for MRI imaging

Alloys and dental copings or abutments formed of alloys include 50-60 wt % gold, 5-14 wt % platinum, 0.1-3.0 wt % iridium and the remainder palladium. Other alloys and dental copings or abutments formed of alloys include 58 wt % gold, 10 wt % platinum, 1.0 wt % iridium, and 31 wt % palladium. The alloys are capable of withstanding temperature profiles during casting and multiple high temperature exposures of porcelain firing without excessive softening. The alloys also exhibit advantageous shear strain properties giving the alloys improved manufacturability characteristics.

Gold-based alloy, free of silver and tin, for dental copings or abutments

A family of alloys for use in medical, electrical contact and jewelry applications includes as primary components palladium, and boron and at least one of ruthenium, rhenium, platinum, gold, zirconium, tungsten, cobalt, nickel, tantalum and iridium. An alternative embodiment includes palladium and rhenium and/or ruthenium with an additional element iridium, platinum, tungsten, boron, gold, zirconium, cobalt, nickel and tantalum. The present alloy family has a high strength, high radio opacity, and biocompatibility characteristics, while also being workable into various configurations. Where required, some of the alloys also offer post form, heat treatment (age hardening) capabilities for even higher hardness and strength levels.

Palladium alloy

A family of copper-nickel-zinc-palladium alloys for sliding and static electrical contact applications comprises, on a weight percent basis, about 15-65 percent copper, up to about 30 percent nickel, about 5-30 percent zinc, about 5-45 percent palladium, and up to about 35 percent silver. One embodiment of the family of alloys is age hardenable and provides alloys with hardness values in excess of 300 Knoop (100g load) and significant improvement in high-temperature properties, formability, tensile strength and ductility. A second embodiment provides an alloy with increased strength and hardness in the wrought condition, relative to the prior art Cu&mdash;Ni&mdash;Zn alloys.

Cu-Ni-Zn-Pd alloys

A silver/palladium alloy for electrical contact applications comprises, on a weight percent basis, 20-50 silver, 20-50 palladium, 20-40 copper, less than 1.0 nickel, 0.1-5 zinc, 0.01-0.3 boron, and up to 1 percent by weight of modifying elements selected from the group consisting of rhenium, ruthenium, gold, and platinum. The combination of zinc and boron provides an alloy of high strength and hardness and permits the use of lower amounts of both copper and palladium.

High strength silver palladium alloy

A silver/palladium alloy for electronic applications comprises, on a percent by weight basis, 35-60 silver, 20-44 palladium, 5-20 copper, 1-7 nickel, 0.1-5 zinc, to 0.18 boron, up to 0.05 rhenium and up to 1 percent by weight of modifying elements selected from the group consisting of ruthenium, zirconium and platinum. This alloy exhibits high oxidation and tarnish resistance and is formed into wrought electronic components such as contacts and brushes to provide low noise.

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Orange, CT, United States of America

Arthur S Klein