Johns Hopkins University

Arthur S Francomacaro

Harry K Charles, Jr

Rengaswamy Srinivasan

Paul J Biermann

Jeffrey P Maranchi

Craig B Leese

Lance M Baird

Ryan M Deacon

Gary E Peck

David M Lee

Timothy J Cornish

Seppo J Lehtonen

Deborah M Mechtel

Allen C Keeney

A thin film electrode is fabricated from a non-metallic, non-conductive porous support structure having pores with micrometer-range diameters. The support may include a polymer film. A first surface of the support is metalized, and the pores are partially metallized to create metal tubes having a thickness within a range of 50 to 150 nanometers, in contact with the metal layer. An active material is disposed within metalized portions of the pores. An electrolyte is disposed within non-metalized portions of the pores. Active materials may be selected to create an anode and a cathode. Non-metalized surfaces of the anode and cathode may be contacted to one another to form a battery cell, with the non-metalized electrolyte-containing portions of the anode facing the electrolyte-containing portions of the cathode pores. A battery cell may be fabricated as, for example, a nickel-zinc battery cell.

Method of fabricating thin film electrodes including metal tubes filled with active material

Thin-film electrodes and battery cells, and methods of fabrication. A thin film electrode may be fabricated from a non-metallic, non-conductive porous support structure having pores with micrometer-range diameters. The support may include a polymer film. A first surface of the support is metalized, and the pores are partially metallized to create metal tubes having a thickness within a range of 50 to 150 nanometers, in contact with the metal layer. An active material is disposed within metalized portions of the pores. An electrolyte is disposed within non-metalized portions of the pores. Active materials may be selected to create an anode and a cathode. Non-metalized surfaces of the anode and cathode may be contacted to one another to form a battery cell, with the non-metalized electrolyte-containing portions of the anode facing the electrolyte-containing portions of the cathode pores. A battery cell may be fabricated as, for example, a nickel-zinc battery cell.

Thin film electrodes including metal tubes filled with active material and battery cells, and methods of fabrication

The index of refraction in a length of doped and/or 'doped-and-poled' electro-optic polymers is controlled so that a gradual transition from a low &#x394;n to a high &#x394;n, or vice versa, is achieved for use in, for example, a lightguide-to-fiber transition. Multiple methods for creating this gradual transition are disclosed.

Transitions in refractive index using electro-optic polymers

A gating grid for deflecting ions includes an insulating substrate (), a conducting layer () adhered to the insulating substrate (), and interdigitated electrodes () patterned in the conducting layer by a photolithographic process. A hole () in the insulating substrate beneath the interdigitated electrodes allows ions to pass through the hole in the substrate. A process for making a gating grid for deflecting ions includes adhering a conducting layer () to an insulating substrate (), forming interdigitated electrodes () on the conducting layer (), and then forming a hole () in the insulating substrate beneath the interdigitated electrodes.

Gating grid and method of making same

A method of electrolessly gold plating copper on a printed circuit board (PCB). Starting with a copper patterned PCB, steps include: clean with ultrasonic agitation with the PCB initially oriented vertically and gradually moved to a 45&deg; angle; rinse; sulfuric acid bath with ultrasonic and mechanical agitation; rinse; another sulfuric acid bath with ultrasonic and mechanical agitation; plate the copper with palladium with ultrasonic agitation with the PCB initially oriented at a 45&deg; angle and flipped half way through to opposing 45&deg; angle; rinse; post dip in sulfuric acid; rinse; electrolessly nickel plate with mechanical agitation; rinse; nitrogen blow dry; visual inspection for nickel coverage of the copper; hydrochloric acid bath with manual agitation; rinse; if full nickel coverage was not achieved, repeat preceding steps starting with second sulfuric acid bath; gold flash plate to establish a first layer of gold; rinse; autocatalytic gold plate; rinse; and nitrogen blow dry.

Method for electroless gold plating of conductive traces on printed circuit boards

Growing community of inventors

Eldersburg, MD, United States of America

Arthur S Francomacaro