International Business Machines Corporation

Sun Microsystems, Inc.

Oracle America, Inc.

Other

Arthur R Zingher

Peter Alfred Gruber

Robert J Drost

Ronald Ho

Philip George Emma

Bruce M Guenin

Ashok V Krishnamoorthy

Ephraim Bemis Flint

Kurt R Grebe

Gary W Grube

Igor Y Khandros

Robert K Montoye

Thomas George Ference

Herschel Akiba Ainspan

Charles Allan Brown

Michael E Scaman

Arnold Halperin

Herman Russell Wendt

Richard B Booth

Perwaiz Nihal

Daniel Guidotti

Scott L Jacobs

Burhan Ozmat

Henri D Schnurmann

Rick A Rand

Edward Lee Follmer

Dimitri Kanevsky

Stephane Herman Maes

Benjamin N Eldridge

George Frederick Walker

Christopher Guild Keller

Michael J Palmer

Robert J Baseman

Hideya Kawahara

Thomas A Gregory

Mukund Padmanabhan

Sevgin Oktay

Ronald Franklin Marks

James T Yeh

Danny Cohen

Graham Olive

Anthony J Liberko

Robert J Moffat

Tai-Hon P Chang

Laura Beth Rothman

Mark Jay Charney

Maurice T McMahon

Bernardo Hernandez

Walter W Molzen, Jr

Fritz-Jurgen Hohn

Egon Max Kummer

Bernie Hernandez

Philip J Coane

Charles A Gotwald

Ajay Sharma

Vijay Sonnad

A self-activated front surface bias for photovoltaic solar cell assembly is provided. The solar cell assembly comprises a front surface electrical bias activated by electrical energy generated by the solar cell assembly. The front surface bias improves generation efficiency for said solar cell assembly.

Self-activated front surface bias for a solar cell

One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit chip and signal pads on a second integrated circuit chip. The electromagnetic via couples a signal pad on the active face of the integrated circuit chip to the back face of the integrated circuit chip so that the integrated circuit chip can communicate with the second integrated circuit chip while the back face of the integrated circuit chip is adjacent to the active face of the second integrated circuit chip. Moreover, the electromagnetic via operates by facilitating non-conductive signaling through the integrated circuit chip.

Integrated circuit chip with smart pixels that supports through-chip electromagnetic communication

A system that facilitates high-speed signaling between integrated circuit chips comprising a cable, wherein the cable includes a first and second active connector that facilitate communication between integrated circuit chips. The first active connector includes a capacitive receiver which receives a signal from a corresponding capacitive transmitter located on a first integrated circuit chip through capacitive coupling, and a transmitter which transmits a signal received by the capacitive receiver, through the interconnect medium within the cable, to the second active connector. The second active connector includes a receiver which receives a signal transmitted through the interconnect medium of the cable, and a capacitive transmitter which transmits the signal to a corresponding capacitive receiver located on a second integrated circuit chip through capacitive coupling. Note that the capacitive receivers are not permanently attached to the capacitive transmitters, whereby the cable can be easily remated to other integrated circuit chips.

Proximity active connector and cable

The disclosed embodiments automate context-compensated rendering of text in a graphical environment. In the disclosed embodiments, the system first receives a specification of the graphical environment that includes text to be rendered in the graphical environment. Next, the system determines the parameters of the local environment near the text (e.g., character size and perturbations for perspective and tilt, pixel density, adjacent (local or background) color and brightness, illumination and shadow effects, etc.). The system then dynamically renders text to compensate for those parameters, in order to display the text more clearly.

Automated context-compensated rendering of text in a graphical environment

An apparatus includes a two-dimensional array of single-chip modules (SCMs) and at least one component. A respective SCM in the array includes at least a semiconductor die that is configured to communicate data signals by capacitive coupling using one or more proximity connectors in a first set of proximity connectors. The first set of proximity connectors are coupled to the semiconductor die. A second set of proximity connectors is coupled to at least the one component. At least the one component is coupled to semiconductor dies in two or more SCMs using one or more proximity connectors in the second set of proximity connectors thereby enabling communication of the data signals by capacitive coupling.

Single-chip and multi-chip module for proximity communication

Integrated circuit chip that supports through-chip electromagnetic communication

One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.

Structures and methods for an application of a flexible bridge

An integrated circuit contains within the chip one or more measuring devices that provide a digital value corresponding to respective physical operating parameters of the chip. The digital values can be communicated to other devices using an interrupt handler.

Digital measuring system and method for integrated circuit chip operating parameters

A device includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to the first surface. The first semiconductor die is configured to have a flexibility compliance greater than a first pre-determined value in a direction substantially perpendicular to a plane including the plurality of proximity connectors in order to reduce misalignment in the direction between the plurality of proximity connectors and additional proximity connectors on another device.

Structures for Z-aligned proximity communication

One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. By matching the wire line size in the flexible bridge to the size of circuits and/or signal pads on the chip and on the second component, the system allows signals to be sent between the circuits on the chip and the second component without having to change the scale of the interconnect, thereby alleviating wireability and bandwidth limitations of conventional chip packaging technologies.

Structures and methods for a flexible bridge that enables high-bandwidth communication

A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.

Multi-chip module and single-chip module for chips and proximity connectors

A device includes a first semiconductor die having a first surface and a second surface, a cable coupled to the first semiconductor die, and at least one memory device coupled to the cable. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to and/or coupled to the first surface.

Engine with cable direct to outboard memory

One embodiment of the present invention provides a system that detects changes in power-supply current within an integrated circuit (IC) chip. During operation, the system monitors an induced current through a detection loop. This detection loop is situated at least partially within the IC chip in close proximity to a power-supply current for the IC chip, so that a change in the power-supply current changes a magnetic field passing through the detection loop, thereby inducing a corresponding current through the detection loop. The system then generates a control signal based on the induced current, so that changes in the power-supply current cause the control signal to change. In addition, the system uses the control signal to control circuits within the IC chip.

Method and apparatus for detecting current changes in integrated circuits

Growing community of inventors

White Plains, NY, United States of America

Arthur R Zingher