7ac Technologies, Inc.

Tokyo Electron Limited

Emerson Climate Technologies Gmbh

Arthur Laflamme

Peter Fransiscus Vandermeulen

Jack I Hanoka

Mark A Allen

Jay R Wallace

Thomas Hamelin

David Pitcher

Robert Doody

Mark Allen

Disclosed are various turbulent, corrosion-resistant heat exchangers used in desiccant air conditioning systems.

Methods and systems for turbulent, corrosion resistant heat exchangers

A desiccant air conditioning system for treating an air stream entering a building space, including a conditioner configured to expose the air stream to a liquid desiccant such that the liquid desiccant dehumidifies the air stream in the warm weather operation mode and humidifies the air stream in the cold weather operation mode. The conditioner includes multiple plate structures arranged in a vertical orientation and spaced apart to permit the air stream to flow between the plate structures. Each plate structure includes a passage through which a heat transfer fluid can flow. Each plate structure also has at least one surface across which the liquid desiccant can flow. The system includes a regenerator connected to the conditioner for causing the liquid desiccant to desorb water in the warm weather operation mode and to absorb water in the cold weather operation mode from a return air stream.

Desiccant air conditioning methods and systems

Desiccant air conditioning systems with conditioner and regenerator heat transfer fluid loops

A processing system and method for chemical oxide removal (COR), wherein the processing system comprises a first treatment chamber and a second treatment chamber, wherein the first and second treatment chambers are coupled to one another. The first treatment chamber comprises a chemical treatment chamber that provides a temperature controlled chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatment. The substrate is exposed to a gaseous chemistry, such as HF/NH, under controlled conditions including surface temperature and gas pressure. The second treatment chamber comprises a heat treatment chamber that provides a temperature controlled chamber, thermally insulated from the chemical treatment chamber. The heat treatment chamber provides a substrate holder for controlling the temperature of the substrate to thermally process the chemically treated surfaces on the substrate.

Processing system and method for treating a substrate

A processing system for thermally treating a substrate including a temperature controlled thermal treatment chamber and a temperature controlled substrate holder for supporting a substrate for thermal treatment. The substrate holder is thermally insulated from the thermal treatment chamber. A method for thermally treating a substrate is also provided.

Processing system and method for thermally treating a substrate

A processing system and method for chemically treating a substrate, wherein the processing system comprises a temperature controlled chemical treatment chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatment. The substrate holder is thermally insulated from the chemical treatment chamber. The substrate is exposed to a gaseous chemistry, without plasma, under controlled conditions including wall temperature, surface temperature and gas pressure. The chemical treatment of the substrate chemically alters exposed surfaces on the substrate.

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Rowley, MA, United States of America

Arthur Laflamme