International Business Machines Corporation

Arthur J Higby

James A Busby

David Clifford Long

Michael J Fisher

John Richard Dangler

Matthew Stephen Doyle

Russell Alan Budd

Philipp K Buchling Rego

William Santiago-Fernandez

Edward N Cohen

Levi A Campbell

Robert L Weiss

Mateusz Koziol

William Louis Brodsky

Silvio Dragone

Camillo Sassano

Robert R Genest

Michel Turgeon

Leung M Hung

Sylvain Tetreault

Tristen Gaudette

Gerald Keith Bartley

Darryl John Becker

Stefano Sergio Oggioni

Mark Kenneth Hoffmeyer

Kevin O'Connell

Matteo Cocchini

Mark James Jeanson

Christopher Michael Marroquin

Roger Scott Krabbenhoft

Jay A Bunt

Zachary Thomas Dreiss

Hongqing Zhang

Enrico A Romano

Brandon R Christenson

David J Lewison

Rorie Paul Reyes

Sterett Baxter Schanze

Lauren Boston

Hannah Wendling

Khaalid Persaud Juggan Mcmillan

William Santiago-fernandez

Franklin Gurney

Embodiments are disclosed for a latch assembly apparatus. The latch assembly apparatus includes an effort arm, latch housing, a fulcrum, and a torsion spring. The latch housing includes a resistance arm having a claw portion, and an ejection arm. The torsion spring is configured to provide a rotational force around the fulcrum, and on the resistance arm, resulting from a tensioning of the torsion spring between a first end of the torsion spring fixed to the effort arm, and a second end of the torsion spring fixed to a predetermined preload hole disposed on the latch housing. Further, when the latch assembly apparatus is mounted to a removable element, and the removable element is placed in a connection with a drawer element by the latch assembly apparatus, the resistance arm applies a preload to the connection.

Latching a removable element with tolerance-stack compliance

A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.

Tearing security feature of printed circuit substrates

An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.

Electronic component comprising first and second conductive traces and a void formed in an insulative layer between the first and second traces providing crosstalk reduction

A latch assembly includes a lever arm affixed to a latch pivot point of rotation with a cam having a connecting slot. A load mechanism is configured to apply a force on the latch pivot point to retain the lever arm in a first position. The load mechanism is tuned to apply the force along a tolerance range of operation of the latch assembly.

Tunable tolerance stack-compliant latching

Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.

Cryptographic hardware security module with secure embedded heat pipe

A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.

Secure ventilation through protective flexible sensors

Tamper-respondent assemblies are provided which include an enclosure mounted to a circuit board and enclosing one or more components to be protected within a secure volume. A tamper-respondent sensor covers, at least in part, an inner surface of the enclosure, and includes at least one tamper-detect circuit. A monitor circuit is disposed within the secure volume to monitor the tamper-detect circuit(s) for a tamper event. A pressure connector assembly is also disposed within the secure volume, between the tamper-respondent sensor and the circuit board. The pressure connector assembly includes a conductive pressure connector electrically connecting, at least in part, the monitor circuit and the tamper-detect circuit(s) of the tamper-respondent assembly, and a spring-biasing mechanism to facilitate breaking electrical connection of the conductive pressure connector to the tamper-detect circuit(s) with a tamper event.

Tamper-respondent assemblies with pressure connector assemblies

Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

Tamper-respondent assemblies with porous heat transfer element(s)

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

Leakage characterization for electronic circuit temperature monitoring

An electronic system can include an electronic module and a trace circuit that provides a perimeter that encloses the electronic module. A sensing circuit within the electronic system can be configured to detect a discontinuity in the perimeter. In response to detecting the discontinuity in the perimeter, the sensing circuit can initiate, from a response device, a response signal.

Leakage characterization and management for electronic circuit enhancement

A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.

Dielectric material change to optimize electrical and mechanical properties of flex circuit

Tamper-respondent assemblies and fabrication methods are provided which utilize liquid crystal polymer layers in solid form. The tamper-respondent assemblies include a circuit board, and an enclosure assembly mounted to the circuit board to enclose one or more electronic components coupled to the circuit board within a secure volume. The assembly includes a tamper-respondent sensor that is a three-dimensional multilayer sensor structure, which includes multiple liquid crystal polymer layers, and at least one tamper-detect circuit. The at least one tamper-detect circuit includes one or more circuit lines in a tamper-detect pattern disposed on at least one liquid crystal polymer layer of the multiple liquid crystal polymer layers. Further, a monitor circuit is provided disposed within the secure volume to monitor the at least one tamper-detect circuit of the tamper-respondent sensor for a tamper event.

Tamper-respondent sensors with liquid crystal polymer layers

Embodiments of the invention are directed to a method for creating a secure volume. A method includes adhering a flexible circuit to a surface of an enclosure. A first portion of the flexible circuit extends outward from the perimeter of the enclosure. A second portion of the flexible circuit is adhered to the center portion of the enclosure. Pressure is applied to the flexible circuit to ensure that it is affixed to the enclosure. The flexible circuit and the enclosure are then subjected to an annealing temperature. The duration and temperature are based on the adhesive and flexible circuit material. The extended portion of the flexible circuit is coated with an adhesive and folded over the second portion of the flexible circuit. Pressure is applied to the folded flexible circuit. The folded flexible circuit is then subjected to an annealing temperature.

Creating a secure volume

A process for deforming a flex circuit using a fixture assembly including a base plate having a recess, a wrinkle reducer plate, a stiffening block and a punch. The process including heating the fixture assembly; applying a force to the punch deforming the flex circuit into the recess in the base plate; holding the punch in contact with the flex circuit while heating the fixture assembly; cooling the fixture assembly with the punch in contact with the flex circuit; subsequent to cooling the fixture assembly, removing the force of the punch; and removing the flex circuit from the fixture assembly. The flex circuit having a recessed portion resulting from deforming the flex circuit into the recess in the base plate and a flat portion surrounding the recessed portion.

3-D flex circuit forming

A plugging calibration tool is provided. The plugging calibration tool includes a body and a slide clamp assembly. The body includes keying portions, flanges and a calibrator. The slide clamp assembly includes a slide clamp, which is movable between the keying portions and the flanges, and biasing and locking elements. The biasing and locking elements are respectively configured to bias the slide clamp toward and to lock the slide clamp in abutment with a tool head, which is fittable between the keying portions and the slide clamp, such that the tool head engages with the keying portions. A head of a screw engaged with the tool head is receivable in the calibrator and rotatable in the calibrator such that the head of the screw is drawn into abutment with a calibration surface of the calibrator while the tool head engages with the keying portions.

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Cottekill, NY, United States of America

Arthur J Higby