E.i. Dupont De Nemours and Company

Arthur Harvey Mones

Lewis Charles Hoffman

Charles William McMunn

Oliver Alton Short

Jay Robert Dorfman

Thomas D Lantzer

Richard R Draudt

David L Sutton

The invention is directed to a method for rapidly forming a dense pattern of via holes in multilayer electronic circuits in which via holes in the dielectric layers are formed by drilling with an excimer laser under controlled operating conditions.

Method for forming via holes in multilayer circuits

This invention relates to dispersions of gold and a certain inorganic binder in an inert liquid vehicle, useful in the electronics art for producing conductor patterns adherent to substrates. Small amounts of the binder are effective in producing excellent adhesion to substrates, such as ceramic substrates. The binders comprise certain amounts of the crystalline materials PbF.sub.2, Cu.sub.2 O, and CdO, in addition to a glass of, by weight, 45-52% PbO, 3-6% B.sub.2 O.sub.3, 30-35% SiO.sub.2, 4-6% TiO.sub.2, 2-4% ZrO.sub.2, 0-1% ZnO, 1-4% Na.sub.2 O, 0-4% CdO, and 0-2% Li.sub.2 O.

Gold conductor compositions

This invention relates to dispersions of gold and a certain inorganic binder in an inert liquid vehicle, useful in the electronics art for producing conductor patterns adherent to substrates. Small amounts of the binder are effective in producing excellent adhesion to substrates, such as ceramic substrates. The binders comprise certain amounts of the crystalline materials, PbF.sub.2, Cu.sub.2 O, and CdO, in addition to a glass of, by weight, 45-52% PbO, 3-6% B.sub.2 O.sub.3, 30-35% SiO.sub.2, 4-6% TiO.sub.2, 2-4% ZrO.sub.2, 0-1% ZnO, 1-4% Na.sub.2 O, 0-4% CdO, and 0-2% Li.sub.2 O.

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Wilmington, DE, United States of America

Arthur Harvey Mones