Case Western Reserve University

Other

Arthur H Heuer

Harold Kahn

Jie Yang

Wyatt S Newman

James D Cawley

Joseph Collin Farmer

Craig A Blue

John Harry Perepezko

Louis F Aprigliano

Jeffery J Haslam

Enrique J Lavernia

Nancy Yuan Yang

Larry Kaufman

Sumner Daniel Day

Mark R DeGuire

Frank M G Wong

Robert Bayles

Stephen M Phillips

Xiaoyan (Jane) Ji

Chaim N Sukenik

John D K Rivard

Leslie K Kohler

Edward J Lemieux

Frank Ernst

Zhen Li

A process for surface activation or depassivation of an article, in particular an alloy, by immersion of the alloy in an aqueous acid solution. The surface activation methods of the present invention can be performed during a relatively short period of time and achieve reductions in production costs and provide environmental friendliness as compared to prior art processes. In a further embodiment, after surface activation, the article is immersed in a second liquid that prevents re-formation of a passivating oxide layer on the surface of the article. In a further embodiment the surface-activated alloys are subjected to surface engineering by a process that infuses carbon or nitrogen through the surface at a temperature sufficiently low to suppress precipitation of carbides or nitrides.

Alloy surface activation by immersion in aqueous acid solution

A method of coating a surface comprising providing a source of amorphous metal that contains manganese (1 to 3 atomic %), yttrium (0.1 to 10 atomic %), and silicon (0.3 to 3.1 atomic %) in the range of composition given in parentheses; and that contains the following elements in the specified range of composition given in parentheses: chromium (15 to 20 atomic %), molybdenum (2 to 15 atomic %), tungsten (1 to 3 atomic %), boron (5 to 16 atomic %), carbon (3 to 16 atomic %), and the balance iron; and applying said amorphous metal to the surface by a spray.

Compositions of corrosion-resistant Fe-based amorphous metals suitable for producing thermal spray coatings

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations.

Multi-layer assemblies with predetermined stress profile and method for producing same

Large area polysilicon films with predetermined stress characteristics and method for producing same

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin film may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films.

Low stress polysilicon film and method for producing same

An apparatus for forming an integral three-dimensional object from a plurality of individual laminations includes a cutting surface on which each of the laminations is individually deposited. A concentrated energy source cuts each of the plurality of laminations into a shape required for assembly of the laminations into the integral three-dimensional object. A transfer mechanism removes each of the cut laminations from the cutting surface and stacks each of the cut laminations on an assembly surface. The transfer mechanism includes a gripper face having a peripheral portion and a central portion. A mask is positioned on the gripper face. The mask has an apertured central portion corresponding to the cut lamination. A source of suction communicates with the gripper face and a valve mechanism selectively draws a suction on the gripper face peripheral portion, the gripper face central portion, both or neither. An electronic control device is provided for controlling the operation of the cutting surface, the concentrated energy cutter and the transfer mechanism.

Selective vacuum gripper

A method for manufacturing an integral three dimensional object from laminations includes the steps of fabricating a plurality of first sheets of a first material composition, cutting each of the first sheets to form a contoured layer representing a cross-section of the three dimensional object and to form a waste material and discarding the waste material. The contoured layers are stacked in a desired sequence to form a stack of contoured layers which are then laminated. Subsequently, the contoured layers of the stack are secured to each other to form the integral three dimensional object. This method works particularly well with ceramic material sheets. If desired, a second type of sheet made of a fugitive material can also be cut to form a contoured layer representing a void in a cross-section of the three dimensional object. The contoured layers of the second sheets are then stacked along with the contoured layers of the first sheets to form the object. The laminated stack of contoured layers is then sintered. During processing, fugitive material can be removed, leaving voids in the three dimensional object.

Method for constructing three dimensional bodies from laminations

Synthesis of metal oxide thin films

Iron and titanium oxide thin films are deposited onto functionalized self-assembled monolayers (SAMs) which are bonded to silicon or glass substrates. The resulting oxide thin films have ordered, uniform densely packed crystalline structures.

Growing community of inventors

Cleveland, OH, United States of America

Arthur H Heuer