Dow Corning Corporation

Hemlock Semiconductor Corporation

Arthur Francis Porsche

Lydia L Hwang

A method for removing metal surface contaminants from silicon metalloid. The method comprises sequentially contacting the silicon with gaseous hydrogen fluoride and then with an aqueous solution comprising at least one-half weight percent hydrogen peroxide. The method is especially useful as a means for recovering metal surface contaminants on semiconductor grade silicon for analysis of surface contamination of the silicon by such metals. The method is useful for recovering copper from the surface of semiconductor grade silicon in an aqueous solution which can be analyzed directly to determine the amount of copper contamination of the surface of the silicon.

Method for removing metal surface contaminants from silicon

A process of reaction injection molding of polyurethanes is disclosed which includes the mixing of one or more of each of polyols, isocyanates, and catalysts, the reaction of the foregoing ingredients, and the molding and curing of the foregoing mixture into the desired configuration, the improvement comprising mixing with the other ingredients a silicone selected from the group consisting of

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Midland, MI, United States of America

Arthur Francis Porsche