Samsung Electronics Co., Ltd.

Arthur Darbinian

Chang-youl Moon

Su-ho Shin

Soon-cheol Kweon

Kyu-ho Shin

Ki-hwan Kwon

Seung-tae Choi

Ki Hwan Kwon

Kyu Ho Shin

Chang Youl Moon

Seung Tae Choi

An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

LED package and fabrication method thereof

A light emitting device package including a transparent cover having an electrode pattern formed on a bottom surface thereof; a light emitting device installed below the transparent cover and electrically connected to an external circuit via the electrode pattern; a fixing resin which fixes the light emitting device onto the bottom surface of the transparent cover; and a metal slug provided under the fixing resin to dissipate heat away from the light emitting device.

Light emitting device package having a transparent cover

Growing community of inventors

Suwon-si, South Korea

Arthur Darbinian