Texas Instruments Corporation

Arthur Bayot

Ferdinand Borromeo Arabe

Eric P Velasquez

Emory M Mercado

Emmanuel A Evangelista

Solder contacts can be formed on the conductive sites of a substrate by placing preformed solder balls on the conductive sites and then reflowing the solder balls to bond the solder balls to the conductive sites. After formation of the solder contacts, solder flux can be applied to at least a portion of the solder contacts. The solder contacts can then be reflowed to substantially improve the adhesion of the solder contacts to the conductive sites and increase the shear strength of the solder contacts.

Solder contact reworking using a flux plate and squeegee

Apparatus and methods for removing solder ball connections from electrical circuits are disclosed. The apparatus and methods comprise a solder ball removing tool having a multiplicity of raised ribs defining a contact surface and made up of heat conductive material having a melting point above the melting point of solder. There is also included a heating source for heating at least a portion of the multiplicity of raised ribs to a temperature sufficient to melt the solder and yet below the melting temperature of the conductive material. The tool is preferably supported or constructed such that the contact surface is tilted so that the melted solder will run down the raised ribs into a collecting pan

Desolder apparatus

A method of manufacturing a ball grid array semiconductor package includes the step of providing a substrate ( ) having a first surface ( ) and a second surface ( ), in which the first surface ( ) or the second surface ( ) include a conductor pattern ( ). The method also includes the step of disposing a plurality of conductive bumps ( ) on the first surface ( ) of the substrate ( ) and attaching a semiconductor die ( ) to the second surface ( ) of the substrate ( ). The method further includes the step of electrically connecting the conductive bumps ( ) to the conductor pattern ( ), such that electrically connecting the conductive bumps ( ) to the conductor pattern ( ) mechanically affixes the conductive bumps ( ) to the first surface ( ) of the substrate ( ). The method also includes the steps of mechanically testing the ball grid array semiconductor package ( ) to determine whether a height of the conductive bumps ( ) are substantially uniform, and planarizing the conductive bumps ( ) when the height of the conductive bumps are non-uniform.

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Baguio, Philippines

Arthur Bayot