Sundstrand Corporation

Arthur A Pershall

Edward W Smith

W Kyle Anderson

Stephen E Jackson

Mark W Metzler

William G Durtschi

Lee L Thomas

Robert J Sterling

A semiconductor package includes a plurality of semiconductor devices disposed in an array surrounding a central electrode structure carried by a package support member. The package is capable of withstanding high voltages and currents and includes a heat exchanger integral therewith.

Package for multiple high power electrical components

A conductive bus member operable over a selected operating frequency range includes a cylindrical main body and first and second legs secured to the main body at first and second points whereby first and second current paths having first and second impedances are defined between the first and second points. A predetermined relationship between the first and second impedances is maintained over the selected operating frequency range.

Conductive bus member and method of fabricating same

An electrical device is capable of sensing both AC and DC current which is flowing through an electrical circuit. The electrical device bifurcates the current into separate paths, wherein impedance of each path has a constant relationship to each other. In a further embodiment, the electrical device includes a current sensor for measuring current flowing through the circuit. The sensor is of a type which does not introduce insertion loss.

Frequency-insensitive current sensor

A current sensor operable over a selected operating frequency range includes a flux concentrating core. The core is fabricated by forming a series of tape-wound laminations into a desired closed shape, securing the laminations together at a point and removing material at the point to create a gap.

Method of fabricating a magnetic flux concentrating core

A package for a high power electrical component includes a base and a plate disposed on a support surface of the base and having an electrically insulative layer and an outer layer having a conductive portion thereon. An electrically conductive pad is disposed on the electrically conductive portion of the plate and the electrical component is disposed on the pad. A cover is disposed atop the base and encloses the plate, the pad and the electrical component. First and second electrically conductive terminals extend through apertures in the cover and are electrically coupled to the electrodes of the electrical component. The cover is hermetically sealed to the base and to the first and second terminals. The coefficient of thermal expansion of the base and cover are substantially equal to minimize stresses developed therein.

Growing community of inventors

Rockford, IL, United States of America

Arthur A Pershall