Kla Tencor Corporation

Arpit Jain

Arpit Yati

Arun Lobo

Thirupurasundari Jayaraman

Raghavan Konuru

Olivier Moreau

Hemanta Kumar Roy

Raj Kuppa

Hema Prasad

Saiyashwanth Momula

Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.

Automatic deskew using design files or inspection images

A technique to identify non-visual defects, such as SEM non-visual defects (SNVs), includes generating an image of a layer of a wafer, evaluating at least one attribute of the image using a classifier, and identifying the non-visual defects on the layer of the wafer. A controller can be configured to identify the non-visual defects using the classifier. This controller can communicate with a defect review tool, such as a scanning electron microscope (SEM).

Range-based real-time scanning electron microscope non-visual binner

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Indore, India

Arpit Jain