Globalfoundries U.S. Inc.

Arpan Dasgupta

Norman Whitelaw Robson

Yusheng Bian

Takako Hirokawa

Danny Moy

Vaishnavi Karra

Zahidur Chowdhury

John M Safran

Structures including multiple photonics chips and methods of fabricating a structure including multiple photonics chips. The structure comprises a first chip including a first edge and a first plurality of optical couplers disposed at the first edge, and a second chip including a second edge adjacent to the first edge of the first chip and a second plurality of optical couplers. The second plurality of optical couplers are disposed at the second edge adjacent to the first plurality of optical couplers.

Optical input/output interfaces between photonics chips

Structures including a light source and an edge coupler, and methods of forming and using such structures. The structure comprises a semiconductor substrate and a back-end-of-line stack on the semiconductor substrate. The back-end-of-line stack includes a first dielectric layer, a first plurality of metal features in the first dielectric layer, a second dielectric layer on the first dielectric layer, and a second plurality of metal features in the second dielectric layer. The second plurality of metal features have a non-overlapping relationship with the first plurality of metal features. The structure further comprises an edge coupler adjacent to the first plurality of metal features and the second plurality of metal features.

Photonics chip structures including a light source and an edge coupler

The present disclosure relates to semiconductor structures and, more particularly, to an identification system, method of manufacture and method of use. The structure includes at least one waveguide structure and at least one damaged region positioned in a unique pattern on the at least one waveguide structure.

Identification system

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Beacon, NY, United States of America

Arpan Dasgupta