Sensata Technologies, Inc.

Arnout Van Den Bos

Wico Hopman

Erik Hop

Gerard Klaasse

Erik Krommenhoek

Rob Slakhorst

Robert Zwijze

David J DiPaola

Jan Boldewijn

Zeno Van Veen

Erik De Wit

Frank Gerald Daniel Morsink

Embodiments included herein are directed towards an apparatus and method for manufacturing an electrical cooling apparatus. The method may include forming a first entirely solid metal plate to generate an enclosure. The method may also include affixing a bottom metal plate to the first entirely solid metal plate, the bottom metal plate may define a channel system. The bottom metal plate may include one or more inlet openings into the channel system, where the one or more inlet openings are configured to allow coolant to enter or exit the channel system.

System and method for cooling high power electrical systems

A dual range sensor apparatus includes a single pressure transducer element coupled to respective inputs of two discrete signal conditioning modules, or to both inputs of a multiple input signal conditioning module that is configured to condition the output signal of two transducer elements. The disclosed sensor apparatus outputs a pressure signal in a limited pressure range with very high accuracy, and also provides a pressure signal in a wider pressure range with the same accuracy that can be achieved with traditional pressure sensor configurations. The sensor apparatus may provide output on a single output node in a multiplexed output signal format. The multiplexed output signal format may include several digital output formats and may be provided on a single output pin of the sensor apparatus.

Dual output pressure sensor with single pressure transducer element

Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a microelectromechanical system (MEMS) sensor for pressure measurement. The MEMS sensor is attached to a glass tube which is compressively sealed to a mounting frame that is attachable to a pressure port of a fluid-containing enclosure. Techniques disclosed herein provide an hermetic seal between the tube and the mounting frame and a rigid seal between the MEMS sensor to a pressure sensor while decoupling thermal expansion stress from the MEMS sensor. With such decoupling techniques, pressure sensing reliability and accuracy can be improved because thermal expansion stress is decoupled from the MEMS sensor. Such techniques provide an accurate, durable, and cost-effective pressure sensor.

Hermetically glass sealed pressure sensor

Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a MEMS die for pressure measurement. The MEMS die is attached to a glass pedestal member. The pedestal member is mechanically held in place via a mounting frame that attachable to a pressure port of a fluid-containing enclosure. Techniques herein provide a strong connection of a MEMS die to a pressure sensor while decoupling thermal expansion stress from the MEMS die. With such decoupling techniques, pressure sensing reliability and accuracy can be improved. With thermal expansion stress decoupled from the MEMS die, sensor sealing materials can be selected for their robust chemical properties instead of structural properties. Such techniques provide an accurate, durable, and cost-effective pressure sensor.

Pressure sensor

Techniques disclosed herein include systems and methods for sensor systems for measuring pressure in an exhaust conduit of a combustion engine. The sensor system includes an electronics module assembly and a housing assembly for housing the electronics module assembly. The electronics module assembly can include several components such as sensing element carrier element with a sensing element, an electronics module carrier element carrying electronic components. Electrical connections can be provided between the electronic module carrier element and the sensing element carrier element. Another component includes a main carrier element for supporting the sensing element carrier element and the electronic module carrier element.

Growing community of inventors

Deurningen, Netherlands

Arnout Van Den Bos