Motorola Corporation

Arnold W Hogrefe

Robert Thomas Carson

Lisa Reckleben

Frank J Juskey, Jr

Frank J Juskey

An electronic assembly (10) comprises one or more electronic components (18) having solder terminations (20), and a printed circuit substrate (12) having printed circuit traces (14, 16), wherein at least one of the solder terminations of the one or more electronic components (18) and the printed circuit traces (14, 16) of the printed circuit substrate (12) has a secondary finish produced by application of an electrolessly deposited nickel film (26) containing phosphorus which is further plated with gold (28). An indium-tin-lead solder paste (22) is utilized in a soldering process to attached the one or more electronics components (18) to the printed circuit traces (14,16) on the printed circuit board (12), such that the indium-tin-lead solder (22) provides improved solder joint integrity with the secondary finish. The electronic components (18) include semiconductor devices such as ball grid arrays (1000) and flip-chip integrated circuits (1010).

Electronic assembly

A selective call receiver (900) includes a ceramic substrate (820) for conveying an electrical signal. The ceramic substrate (820) has at least one solder pad which includes a solder pad area (110) of an electrical conductor (120) on the ceramic substrate and a solder wettable layer (210). The electrical conductor (120) consists essentially of a conductive ceramic material. The solder wettable layer (210) is attached to the solder pad area (110). The solder wettable layer (210) includes at least 50% indium by weight. A circuit device (410) has at least one circuit terminal which is soldered to the at least one solder pad of the ceramic substrate (820) for electrical interconnection to another circuit device (410) in the selective call receiver (900).

Selective call radio having a ceramic substrate for circuit device

A solder pad for mechanically and electrically coupling solder terminals (420) of electronic devices (410) to a non-conductive ceramic substrate (130) includes a solder pad portion (110) of a conductive runner (120) and a solder wettable layer (210). The solder pad portion (110) of the conductive runner (120) is on the non-conductive ceramic substrate (130). The conductive runner (120) consists essentially of a conductive ceramic material. The solder wettable layer (210) is attached to the solder pad portion (110). The solder wettable layer (210) includes at least 50% indium by weight.

Conductive solder pad for bonding an electronic device to a ceramic

A conductive adhesive (120) for electrically and mechanically bonding circuit terminals (105) includes a polymer (121) having a predetermined curing temperature range, a first conductive particulate material (125) suspendable in the polymer (121) for providing substantially uniform conductivity throughout the conductive adhesive (120), and a second conductive particulate material (130) suspendable in the polymer (121) for metallurgically bonding together particles of the first particulate material (125). The first conductive particulate material (125) provides substantially uniform conductivity throughout the conductive adhesive (120) and includes metallic particles having a melting point above the curing temperature of the polymer. The second conductive particulate material (130) welds together particles of the first particulate material (125) and includes metallic particles having a melting point within the curing temperature range of the polymer (121).

Growing community of inventors

Ft. Lauderdale, FL, United States of America

Arnold W Hogrefe