Sunpower Corporation

Arnold Villamor Castillo

Emmanuel Chua Abas

Diana Xiaobing Ma

Edmundo Anida Divino

Jake Randal G Ermita

Jose Francisco S Capulong

Chen-An Chen

Kalyana Bhargava Ganti

Vergil Rodriguez Sandoval

Carl Anthony Pangan Pondoyo

Emil Alcaraz Pares

Paul Loscutoff

Hung-Ming Wang

Mark A Kleshock

Chen-an Chen

Raphael M Manalo

Neil G Bergstrom

Mohamad Ridzwan Mustafa

José Francisco S Capulong

A wafer plating fixture for use in simultaneously electroplating a two substrates. The wafer plating fixture including: an electrically conductive carrier bus; a plurality of contact clips electrically coupled to the carrier bus and configured to hold the two substrates in place and electrically couple the two substrates to the carrier bus; and a non-conductive substrate backer to separate the two substrates coupled to the carrier bus. A method of electroplating a plurality of substrates. The method including: mounting two substrates to be plated onto a wafer plating fixture; mounting the wafer plating fixture on a continuous belt of plating system; dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath; and applying a voltage to the two substrates via the wafer plating fixture.

Dual wafer plating fixture for a continuous plating line

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Non-permeable substrate carrier for electroplating

This specification describes semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The semiconductor wafer carriers can include features for avoiding double-slotting, for preventing glove marks on semiconductor wafers, and for providing additional sitting and storage options for the wafer carrier. In some examples, a semiconductor wafer carrier includes multiple notched left-side rods that are parallel in a vertical direction and multiple notched right-side rods that are parallel in the vertical direction. The semiconductor wafer carrier includes one or more bottom rods. The left-side rods, the right-side rods, and the one or more bottom rods are joined to define semiconductor wafer slots.

Semiconductor wafer carriers

Semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The semiconductor wafer carriers can include features for avoiding double-slotting, for preventing glove marks on semiconductor wafers, and for providing additional sitting and storage options for the wafer carrier. In some examples, a semiconductor wafer carrier includes multiple notched left-side rods that are parallel in a vertical direction and multiple notched right-side rods that are parallel in the vertical direction. The semiconductor wafer carrier includes one or more bottom rods. The left-side rods, the right-side rods, and the one or more bottom rods are joined to define semiconductor wafer slots.

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

Maintainable substrate carrier for electroplating

Growing community of inventors

Batangas, Philippines

Arnold Villamor Castillo