Robert Boschgmbh

Arno Stoetzler

Frank Klopf

Juergen Kober

Ralf Henn

Axel Jasenek

A sensor assemblage, in particular a high-pressure sensor assemblage, includes a substrate element and a connector element, the substrate element comprising a sensor structure having a pressure-sensitive diaphragm and a cavity disposed in the region of the diaphragm, the substrate element being connected to the connector element in such a way that the cavity is connected to a hollow space of the connector element, the substrate element moreover including at least one further sensor structure having a pressure-sensitive further diaphragm and a further cavity disposed in the region of the further diaphragm, the further cavity being connected to a further hollow space of the at least one connector element or of a further connector element.

Sensor assemblage and method for manufacturing a sensor assemblage

A high-pressure sensor device has a pressure sensor element and an electric circuit, in particular in the form of a semiconductor component, the pressure sensor element having a membrane deformable under the effect of pressure, and a functional layer, which experiences a change in its electrical properties when deformed, and which has at least one electric terminal area, and the design and the manufacturing process being simplified in particular by the fact that the semiconductor component is directly connected to the electric terminal area via a solder layer.

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Reutlingen, Germany

Arno Stoetzler