Atotech Deutschland Gmbh

Arno Clicque

Heiko Brunner

Christian Sparing

Thomas Huelsmann

Patrick Brooks

Adrian Zee

A method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. The method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (I), wherein:

Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound

The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).

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Berlin, Germany

Arno Clicque