Osram Oled Gmbh

Pictiva Displays International Limited

Cambridge Display Technology Limited

Oram Oled Gmbh

Arne Fleissner

Nina Riegel

Thomas Wehlus

Daniel Riedel

Erwin Lang

Johannes Rosenberger

Silke Scharner

Sebastian Wittmann

Armin Heinrichsdobler

Jeremy H Burroughes

Dominik Pentlehner

Carola Diez

Colin Baker

Surama Malik

Laurence Scullion

Marc Philippens

Simon Schicktanz

Andreas Rausch

Julian Charles Carter

Andrew Ingle

Arndt Jaeger

Ulrich Niedermeier

Richard Baisl

Philipp Schwamb

Evelyn Trummer-Sailer

Egbert Hoefling

Tobias Pohl-Zander

An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.

Organic optoelectronic component

Organic optoelectronic component with a coupling-out layer

A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.

Multilayer encapsulation, method for encapsulating and optoelectronic component

Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.

Optoelectronic component and protective layer

An optoelectronic assembly including an optically active region configured for emitting and/or absorbing light, and an optically inactive region configured for component-external contacting of the optically active region is provided. The optically inactive region includes a dielectric structure and a first electrode on or above a substrate, an organic functional layer structure on the first electrode in physical contact with the first electrode and the dielectric structure, and a second electrode in physical contact with the organic functional layer structure and above the dielectric structure, wherein the organic functional layer structure at least partly overlaps the dielectric structure in such a way that the part of the second electrode above the dielectric structure is free of a physical contact of the second electrode with the dielectric structure.

Optoelectronic assembly and method for producing an optoelectronic assembly

The invention relates to an organic optoelectronic component () comprising a first electrode layer (), having a doped matrix material and metal nanowires, an organic active layer (), which is suitable for emitting or detecting electromagnetic radiation, and a second electrode layer (). The organic active layer () is directly adjacent to the first electrode layer (). The invention further relates to a method for producing the organic optoelectronic component ().

Organic optoelectronic component and method for producing the same

An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit a radiation during operation of the component, and a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, and a difference in the refractive indices of the structured layer and the planarization layer is smaller than 0.3 at least in places.

In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.

Method for producing an optoelectronic device, and an optoelectronic device produced by the method

The invention relates to an optoelectronic component, the optoelectronic component comprises a light-emitting layer stack, and an electrothermal protection element, which is connected to the layer stack in the component and has a temperature-dependent resistor.

Optoelectronic component and method for operating an optoelectronic component

A light-emitting component is provided including a functional layer stack having at least one light-emitting layer which is set up to generate light during the operation of the component, a first electrode and a second electrode, which are set up to inject charge carriers into the functional layer stack during operation, and an encapsulation arrangement having encapsulation material, which is arranged above at least one of the electrodes and the functional layer stack. At least one of the electrodes is transparent and contains a wavelength conversion substance and/or the encapsulation material is transparent and contains a wavelength conversion substance.

Light-emitting component and method for producing a light-emitting component

The organic light-emitting diode () has a first electrode () with a first electric conductivity and a second electrode () with a second lower electric conductivity. An organic layer stack () for generating light is located between the electrodes (). The light-emitting diode () further comprises a current distribution layer () with a third high electric conductivity. When seen in a plan view, multiple contact regions () are located outside of an outer contour line () of the layer stack (). The second electrode () and the current distribution layer () contact each other in the contact regions (). In a current blocking region (), the current distribution layer () is located entirely within the contour line () such that the second electrode () is electrically disconnected from the current distribution layer (). The luminous intensity of a lighting surface () of the light-emitting diode () is preferably set in a controlled manner via the distribution of the contact regions () and the current blocking regions ().

Organic light-emitting diode and vehicle exterior lighting

An organic light-emitting component device comprising a first and second organic light-emitting component, a temperature detecting device configured for detecting at least one temperature, and a control unit coupled to the temperature detecting device and configured to operate the first and second component. The control unit is such that a first or second operating parameter of the first or second component, respectively, is changed, wherein the temperature detecting device comprises a first and second temperature detecting device. The first and second temperature detecting devices are designed for detecting a first and second temperature of the first and second component, respectively. The control unit is configured to change the first or second operating parameter depending on the difference between the first and second temperature, wherein the first or second operating parameter is changed such that the same temperature is established at the first and second component.

Organic light-emitting component device, method for producing an organic light-emitting component device and method for operating an organic light-emitting component device

In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. The surface in a predefined region is free of optically active layer structure. The optoelectronic component further includes an encapsulation structure having an inorganic encapsulation layer. The inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region. The inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate. The surface of the substrate at least in the predefined region includes a structuring. The structuring is configured to increase the roughness of the surface. The substrate at least in the predefined region at the surface thereof includes or is formed from an inorganic material.

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Wuppertal, Germany

Arne Fleissner