Robert Boschgmbh

Arne Dannenberg

Mike Schwarz

Thomas Friedrich

Volkmar Senz

Helmut Grutzeck

Jochen Franz

Achim Breitling

Torsten Kramer

Joachim Fritz

Franz Laermer

Frank Schatz

Jochen Rupp

Christian Dorrer

Christian Patak

Stephan Oppl

Sevki Gencol

Heiko Stahl

Frank Reichenbach

Friedjof Heuck

Robert Maul

Andreas Duell

Juergen Steigert

Daniel Haug

Timo Lindemann

Stefan Zehringer

Michaela Mitschke

Tobias Henn

Tamer Sinanoglu

Ferenc Lukacs

Marco Schreiter

Tamas Dögei

Daniel Kaercher

Soeren Zimmermann

Rainer Eckstein

Melanie Hoehl

A MEMS sensor. The MEMS sensor includes a deflectably situated functional layer, a conversion device for converting a deflection of the functional layer into an electrical signal, the conversion device including at least one electrical element, the at least one electrical element being at least partially electrically connected to a first area, and the first area being at least partially electrically connected to a second area, and the first and second areas and/or the first area and the at least one electrical element being electrically operable in a reverse direction and a forward direction, and a control unit, the control unit being designed to at least partially operate the at least one electrical element and the first area and/or the first area and the second area in the forward direction to provide thermal energy.

MEMS sensor as well as method for operating a mems sensor

A method for manufacturing a substrate including a region, which is mechanically decoupled from a support and has at least one component situated on the region; at least one recess being introduced on a front side of the substrate; an etching pattern being prepared on a back side of the substrate and etched anisotropically in such a manner, that vertical channels are produced on the back side of the substrate; and subsequently, a cavity being introduced at the back side of the substrate; the at least one recess on the front side of the substrate being connected to the cavity on the back side of the substrate; and in at least one region between the front side of the substrate and the cavity, at least two recesses or at least two segments of a recess being interconnected by at least one channel.

Method for manufacturing a substrate having a region mechanically decoupled from a support, method for manufacturing at least one spring, and a substrate

A method for manufacturing a micromechanical sensor, in particular a pressure difference sensor, including creating a functional layer on a substrate; creating at least one rear side trench area proceeding from a rear side of a substrate, for exposing the functional layer for a sensor diaphragm; creating at least one front side trench area for forming at least one supporting structure, in particular an energy storage structure, preferably in the form of a spring structure, in the substrate as a mounting for the sensor diaphragm; and at least partially filling at least a front side trench area with a gel.

Method for manufacturing micromechanical diaphragm sensors

A micromechanical pressure sensor device is equipped with a sensor substrate including a front side and a rear side. The device includes a pressure sensor unit suspended in the sensor substrate, a first cavity above the pressure sensor unit, which is exposed toward the front side via one or multiple access openings, one or multiple stress relief trenches, which laterally enclose the pressure sensor unit and form a fluidic connection from the rear side to the first cavity, and a circuit substrate, on which the rear side of the sensor substrate is bonded. A second cavity, which is in fluidic connection with the stress relief trenches, is formed below the pressure sensor unit in the circuit substrate. At least one channel is provided in a periphery of the pressure sensor unit, which is in fluidic connection with the second cavity and is exposed to the outside.

Micromechanical pressure sensor device and corresponding manufacturing method

A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm spanning the cavity; and a lever element that spans the diaphragm and has a first and second end section on opposite sides of a center section. A first joint element is between the first end section and the substrate and a second joint element is between the center section and the diaphragm. The lever element can be pivoted due to a deflection of the diaphragm. Two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes are disposed so that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Also, an actuator is provided for applying an actuating force between the lever element and the substrate.

Linearized micromechanical sensor

A method for manufacturing a MEMS unit for a micromechanical pressure sensor. The method includes the steps: providing a MEMS wafer including a silicon substrate and a first cavity formed therein, under a sensor membrane; applying a layered protective element on the MEMS water; and exposing a sensor core from the back side, a second cavity being formed between the sensor core and the surface of the silicon substrate, and the second cavity being formed with the aid of an etching process which is carried out with the aid of etching parameters changed in a defined manner; and removing the layered protective element.

Method for manufacturing a MEMS unit for a micromechanical pressure sensor

A micromechanical pressure sensor, having&#x2014;a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm; and&#x2014;a pressure sensor frame; and&#x2014;a spring element for the mechanical connection of the pressure sensor core to the pressure sensor frame being developed in such a way that a mechanical robustness is maximized and a coupling of stress from the pressure sensor frame into the sensor pressure core is minimized.

Micromechanical pressure sensor

A micromechanical pressure sensor, having a sensor core formed in a silicon substrate in a pressure-sensitive region, having a sensor membrane, a first cavity being formed in the silicon substrate on the sensor membrane; a second cavity formed between a rear-side surface of the silicon substrate and the sensor core, access holes that go out from the rear-side surface of the silicon substrate being connected to the second cavity; and at least one anchoring recess going out from the rear-side surface being formed in an anchoring region of the silicon substrate surrounding the pressure-sensitive region, the anchoring recess being formed such that a molding compound can flow into the anchoring recess.

Micromechanical pressure sensor and method for producing said micromechanical pressure sensor

A method for producing a micromechanical pressure sensor. The method includes: providing a MEMS wafer having a silicon substrate and a first cavity developed therein underneath a sensor diaphragm; providing a second wafer; bonding the MEMS wafer to the second wafer; and exposing a sensor core from the rear side; a second cavity being formed in the process between the sensor core and the surface of the silicon substrate, and the second cavity being developed with the aid of an etching process which is carried out using etching parameters that are modified in a defined manner.

Method for producing a stress-decoupled micromechanical pressure sensor

A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.

Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component

A sensor apparatus having at least one magnet core, on at least one carrier surface, which encompasses at least one soft magnetic material and for which a respective longitudinal center plane, which is oriented perpendicularly to the carrier surface and divides the respective magnet core into two halves having an identical mass, is definable, at least one coil being on, around, and/or adjacent to the at least one magnet core, the at least one magnet core having in its interior sub-regions by which an initiation of a magnetization reversal of the respective magnet core is targetedly locally controllable since a drive energy to be applied for propagation of a magnetic domain wall is elevated. Also described is a manufacturing method for a sensor apparatus having at least one magnet core, and a method for ascertaining a field strength of a magnetic field in at least one spatial direction.

Sensor apparatus, production method for a sensor apparatus having at least one magnetic core and method for determining a field strength of a magnetic field in at least one spatial direction

A magnetic sensor device having a first magnetic core structure which is aligned along a first central longitudinal axis and has at least one first coil, and having a second magnetic core structure which includes at least one second coil, the second magnetic core structure extending from a first end face of the second magnetic core structure along a second central longitudinal axis to a second end face of the second magnetic core structure, the second central longitudinal axis lying in a plane aligned in a direction normal to the first central longitudinal axis, and the second magnetic core structure being positioned in relation to the first magnetic core structure in such a way that a clearance between the first end face of the second magnetic core structure and a first center of mass of the first magnetic core structure is less than 20% of a maximum extension of the first magnetic core structure along the first central longitudinal axis.

Magnetic sensor device and manufacturing method for a magnetic sensor device

A microtechnical component for a magnetic sensor device or a magnetic actuator includes: a magnetic core oriented along an axis; a first drive coil having windings arranged in a first direction of rotation about the magnetic core; a contact, via which a first current flow is created in a first current direction through the first drive coil; and a second drive coil having windings arranged in a second direction of rotation about the magnetic core, the first and second directions of rotation differing from one another. Simultaneously with the first current flow, a second current flow is created via the contact in a second current direction opposite the first current direction through the second drive coil.

Microtechnical component for a magnetic sensor device or a magnetic actuator and production method for a microtechnical component for a magnetic sensor device or a magnetic actuator

A micro-dosing pump includes a pump chamber substrate, a flexible membrane, a fluid line, a valve disk, a magnetizable actuator disk, and a drive unit. The pump chamber substrate has a pump chamber. The flexible membrane is on a first side of the pump chamber substrate and covers the pump chamber in a fluid-tight manner. The fluid line is on a second side of the pump chamber substrate such that fluid can enter and leave the pump chamber. The valve disk, arranged inside the pump chamber, has a fluid through-opening and is configured to close the fluid line by rotating and to open it via the through-opening. The actuator disk is coupled to the valve disk such that rotating the actuator disk rotates the valve disk. The drive unit has a pump plunger configured to move the membrane for suction or ejection of fluid and to rotate the actuator disk.

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Metzingen, Germany

Arne Dannenberg