Plansee Aktiengesellschaft

Arndt Lüdtke

Heiko Wildner

Günter Kneringer

A package is configured as a composite component with a substrate, at least one semiconductor component, and an enclosure, which are joined to one another. The heat-dissipating substrate is a single-layer or multilayer substrate with a thermal conductivity, transversely with respect to a joining surface to which the semiconductor component is joined, of greater than 170 W/m. The substrate may be a layered structure and/or a structure of graduated material composition, and it has an asymmetrical thermal expansion characteristic. By suitable selection the layers or the material graduation, it is possible to reduce and limit the shear distortion of the composite component formed of the substrate, the semiconductor component, and the enclosure.

Package with a substrate of high thermal conductivity

A module serves as a heat sink for semiconductor components. The module includes a diamond/composite substrate that carries a multilayer coating on at least one substrate surface and a housing frame made from ceramics which is soldered onto the substrate. The module excellently fulfills the demands imposed on it, namely a good ability for areally joining to the semiconductor component, a high heat transfer through the joining zone and a good electrical conductivity of the module in the joining zone.

Growing community of inventors

Ehenbichl, Austria

Arndt Lüdtke