Atotech Deutschland Gmbh

Hymite A/s

Alcatel

Arnd Kilian

Jens Wegricht

Ralf Hauffe

Isabel-Roda Hirsekorn

Sebastian Kühne

Christian Nöthlich

Dieter Metzger

Matthias Heschel

Axel Klekamp

Donny Lautan

Mustafa Özkök

Wiltraud Wischmann

Iris Barz

Markus Muskulus

Britta Schafsteller

Kadir Tuna

Gustavo Ramos

Marcus Winter

The present invention concerns a tin plating bath comprising tin ions; at least one complexing agent selected from the group consisting of pyrophosphate ions, linear polyphosphate ions and cyclic polyphosphate ions and a nitrogen and sulfur containing stabilizing additive and titanium (III) ions as a reducing agent suitable to reduce tin ions to metallic tin. The present invention further discloses a method of depositing tin or a tin alloy onto a surface of a substrate. The tin plating bath is particularly suitable to be used in the electronics and semiconductor industry.

Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate

The present invention relates to method for activating a copper or copper alloy surface for depositing a metal or metal alloy layer by electroless (autocatalytic) plating thereon wherein the formation of undesired voids is suppressed. The copper or copper alloy surface is contacted with palladium ions, at least one phosphonate compound and halide ions followed by electroless (autocatalytic) deposition of a metal such as palladium or a metal alloy such as a Ni&#x2014;P alloy.

Method for activating a copper surface for electroless plating

A method and apparatus for regenerating a plating composition which is suitable for depositing at least one first metal on a substrate where the plating rate in the plating composition is very low, where the concentration of the at least one first metal in the plating composition cannot be easily set at a constant level, and where plating-out of the at least one first metal from the plating composition takes place. The method and apparatus for regenerating a plating composition is suitable for depositing at least one first metal on a substrate at a sufficiently high plating rate, while offering the opportunity to easily adjust the concentration of the at least one first metal in the plating composition at a constant level and to provide the plating composition with sufficient stability against decomposition thereof in order to safeguard the regeneration cell from plated-out first metal.

Method and regeneration apparatus for regenerating a plating composition

Method for regenerating a plating composition

The invention concerns an immersion tin plating bath which comprises at least one aromatic sulfonic acid, at least one first precipitation additive and at least one second precipitation additive. The at least one first precipitation additive is an aliphatic poly-alcohol compound, an ether thereof or a polymer derived thereof having an average molecular weight in the range of 62 g/mol and 600 g/mol. The at least one second precipitation additive is a polyalkylene glycol compound having an average molecular weight in the range of 750 to 10,000 g/mol.

Immersion tin or tin alloy plating bath with improved removal of cuprous ions

The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.

Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates

The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and at least one organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions.

Electroless palladium plating bath composition

An autocatalytic tin plating bath containing Snions, Tiions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.

Autocatalytic plating bath composition for deposition of tin and tin alloys

Formation of a structure with through-holes includes attaching two sub-structures to one another. The resulting structure may be used in a sub-assembly for various types of micro components and may serve as a lid or base of a housing that encapsulates one or more micro components. The techniques may provide greater flexibility in the shape of the through-holes and may reduce costs compared with other known techniques.

Method of forming an assembly to house one or more micro components

An optical module comprising an opto-electronic component, a lens and a mirror that is hermetically sealed by a micro housing containing a lid and a base is disclosed. The optical module may be assembled onto a moveable holder for aligning an optical beam into an optical assembly having an optical waveguide.

Optical module hermetically packaged in micro-machined structures

An optical module, such as a package for a vertical cavity surface emitting laser diode (VCSEL) or other light emitting device, includes monitoring of the emitted optical power by tapping the transmitted beam. The module includes a substrate, which carries the light emitting device and an optical monitor. In addition, the module includes a transparent plate with at least two reflective regions that together redirect part of the light from the light emitting device to the optical monitor.

Light transmitting modules with optical power monitoring

Packages that include an integrated lens to help collimate light emitted by or to be received by an optoelectronic device encapsulated within the package are disclosed. The packages may be incorporated into larger optical assemblies.

Optical package with an integrated lens and optical assemblies incorporating the package

A package includes a cap with a solid-state light emitting device mounted within a recess in the cap. A plate is attached to the cap to define a hermetically sealed region in which the light emitting device is housed, and a base is attached to the plate. The plate and base are transparent to a wavelength of light emitted by the light emitting device. An optical wavelength selective element is disposed between the plate and the base to select the wavelength of light to exit the package through the base.

Package with a light emitting device

The disclosure relates to encapsulated optical fiber end-coupled devices. An optical assembly may include a fiber holder and a cap with an optical component mounted to its underside. The optical component may be aligned with a fiber passing between a substrate and a second section of the fiber holder to allow optical signals to be coupled between the optical component and the fiber. Techniques for assembling the fiber holder and the cap may facilitate the formation of hermetic seals to provide a protective environment for the optical component.

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Berlin, Germany

Arnd Kilian