Melexis Technologies Sa

Melexis Technologies Nv

Arnaud Laville

Gael Close

Jian Chen

Samuel Huber Lindenberger

Stefan Rigert

Eric Lahaye

Christian Schott

Samuel Huber

Wouter Leten

Orlin Gueorguiev Saradjov

Matthijs Pardoen

Mathieu Poézart

A sensor device comprising: a lead frame; a first/second semiconductor die having a first/second sensor structure at a first/second sensor location, and a plurality of first/second bond pads electrically connected to the lead frame; the semiconductor dies having a square or rectangular shape with a geometric center; the sensor locations are offset from the geometrical centers; the second die is stacked on top of the first die, and is rotated by a non-zero angle and optionally also offset or shifted with respect to the first die, such that a perpendicular projection of the first and second sensor location coincide.

Stacked die assembly

The present invention relates to a field-sensor device comprising a reference field sensor providing a reference sensor signal in response to a field, a calibrated field sensor providing a calibrated sensor signal in response to the field, a reference circuit connected to the reference field sensor and adapted to receive a reference signal, and an adjustable circuit connected to the calibrated field sensor and adapted to receive a calibrated signal. When the adjustable circuit is adjusted with the calibrated signal, said calibrated signal being different from the reference signal, the calibrated field sensor provides a calibrated sensor signal substantially equal to the reference sensor signal. The field sensor device is arranged to be exposed, when in a calibration mode, to a uniform calibration field and, when in operational mode, to an operational field being a field gradient.

Stray field rejection in magnetic sensors

A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing and connected to the lead frame. The housing comprising at least two recesses or at least two lateral protrusions arranged on two opposite sides of the housing, for allowing the sensor to be mounted to the support. A component assembly comprising said sensor mounted on a support, the support comprising a plurality of first and second posts and a plurality of electrical contacts. A method of producing said component assembly, comprising the step of arranging said sensor with its elongated leads adjacent the first posts, and arranging its lateral protrusions and/or lateral recesses adjacent the second posts, and connecting the elongated leads to the electrical contacts.

Magnetic sensor component and assembly

A field-sensor device comprises a reference field sensor biased with a reference current. The reference field sensor provides a reference sensor signal in response to a field, and a calibrated field sensor biased with an individually adjustable current and providing a calibrated sensor signal in response to the field. A control circuit controls the adjustable current bias of the calibrated field sensor at a calibrated current different from the reference current so that the calibrated field sensor provides a calibrated sensor signal substantially equal to the reference sensor signal in response to a common field. The field sensor device is arranged to be exposed, when in a calibration mode, to a uniform calibration field and, when in operational mode, to an operational field being a field gradient.

A stress sensor () for detecting mechanical stress in a semiconductor chip () has a Wheatstone bridge formed by four integrated resistors Rto R, the resistors Rand Rbeing p-type resistors and the resistors Rand Rbeing n-type resistors.

Stress sensor for measuring mechanical stresses in a semiconductor chip and stress compensated hall sensor

A magnetic angle sensor comprises a semiconductor chip, at least two magnetic field concentrators of planar shape which are arranged on a surface of the semiconductor chip, and four Hall sensors. Each Hall sensor is assigned to one of the magnetic field concentrators and comprises a Hall element or a cluster of Hall elements. The Hall elements are integrated in the semiconductor chip and are arranged in the region of the edge of the assigned magnetic field concentrator where they are permeated by field lines of the magnetic field which extend approximately perpendicularly to the mentioned surface of the semiconductor chip in the region of the edge of the magnetic field concentrator. Two Hall sensors form a first pair of sensors for measuring a first component of the magnetic field and the two other Hall sensors form a second pair of sensors for measuring a second component of the magnetic field. Connecting lines which connect the Hall sensors which are arranged in the region of the edge of the same magnetic field concentrator run either parallel with respect to each other or form a single common line.

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Neuchatel, Switzerland

Arnaud Laville