Robert Boschgmbh

Armin Scharping

Christoph Schelling

Hubert Benzel

Frank Henning

A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.

Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component

A manufacturing method for a micromechanical component, a corresponding composite component, and a corresponding micromechanical component are described. The method has the following steps: providing a first composite of a plurality of semiconductor chips, the first composite having first front and back surfaces; providing a second composite of a corresponding plurality of carrier substrates, the second composite having second front and back surfaces; imprinting a structured adhesion promoter layer on the first front and/or second front surfaces, the layer having degassing channels; aligning the first front and second front surfaces corresponding to a plurality of micromechanical components, each having a semiconductor chip and a corresponding carrier substrate; connecting the first front and second front surfaces via the structured adhesion promoter layer by applying pressure so that a gas from the ambient atmosphere is able to escape to the outside through the degassing channels; and separating the micromechanical components.

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Metzingen, Germany

Armin Scharping