Jenoptik Optical Systems Gmbh

Jenoptik Gmbh

Armin Grundmann

Tobias Gnausch

Thomas Kaden

Robert Buettner

Christian Karras

Stefan Franz

Norik Janunts

Kay Reetz

Thomas Juhasz

Thilo Von Freyhold

Robert BÜTTNER

A method for testing optoelectronic chips that are arranged on a wafer and comprise electric interfaces in the form of contact pads and optical interfaces, which are arranged in a fixed manner relative to the electric interfaces, in the form of optical deflecting elements, e.g. grating couplers, at a specified coupling angle. In the process, the wafer is adjusted in three adjustment steps in such a manner that one of the chips is positioned relative to a contacting module such that the electric interfaces of the chip and the contacting module are in contact with one another and the optical interfaces of the chip and the contacting module assume a maximum position of the optical coupling.

Wafer-level test method for optoelectronic chips

A contacting module and a method for assembling a contacting module with an optical module, containing an optical block made of glass, and with an electronics module, the optical block being connected via an adhesive connection to the electronics module or the optical module having a mounting plate, which is mounted on the electronics module so as to be repeatedly releasable therefrom and is connected to the optical block via an adhesive connection. The adhesive connection is produced via at least three cylinder pins, which each have a first end face bearing against the optical block by an adhesive and are glued in through-bores in the carrier plate or the mounting plate.

Contacting module for contacting optoelectronic chips

A method for the testing of optoelectronic chips which are arranged on a wafer and have electrical interfaces in the form of contact pads and optical interfaces which are arranged to be fixed relative thereto in the form of optical deflection elements, e.g., grating couplers, with a specific coupling angle. The wafer is adjusted in three adjustment steps with one of the chips relative to a contacting module such that the electrical interfaces of the chip and contacting module contact one another, and the optical interfaces of the chip and contacting module occupy a maximum position of the optical coupling.

The invention relates to a contacting module () by means of which the individual electrical and optical inputs and outputs (A) of optoelectronic chips () are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. It is characterized by a comparatively high adjustment insensitivity of the optical contacts between the chips () and the contacting module (), which is achieved, for example, by technical measures which result in the optical inputs (E) of the chip () or on the contacting module () being irradiated in every possible adjustment position by the optical signal (S) to be coupled in.

Position-tolerance-insensitive contacting module for contacting optoelectronic chips

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Jena, Germany

Armin Grundmann