Cognex Corporation

Reify Corporation

Other

Arman M Garakani

David J Michael

Juha Tapio Koljonen

Leonid Taycher

William M Silver

Aaron S Wallack

Peter Roberts

Andrew A Hack

Sean Walter

John P Petry, Iii

The present invention provides methods and apparatus for acquisition, compression, and characterization of spatiotemporal signals. In one aspect, the invention assesses self-similarity over the entire length of a spatiotemporal signal, as well as on a moving attention window, to provide cost effective measurement and quantification of dynamic processes. The invention also provides methods and apparatus for measuring self-similarity in spatiotemporal signals to characterize, adaptively control acquisition and/or storage, and assign meta-data for further detail processing. In some embodiments, the invention provides for an apparatus adapted for the characterization of biological units, and methods by which attributes of the biological units can be monitored in response to the addition or removal of manipulations, e.g., treatments. The attributes of biological units can be used to characterize the effects of the abovementioned manipulations or treatments as well as to identify genes or proteins responsible for, or contributing to, these effects.

Method and apparatus for acquisition, compression, and characterization of spatiotemporal signals

The invention provides a fast, computationally inexpensive, and highly accurate method and apparatus for edge detection in a digital image, even for edges that are not substantially parallel to the axes of the pixel grid, by exploiting computationally inexpensive estimates of gradient magnitude and direction. In particular, the method includes the steps of: estimating gradient magnitude and direction at a plurality of regularly-spaced pixel points in the image so as to provide a plurality of estimates of gradient magnitude and direction, each such estimate being associated with a respective gradient point of a regularly-spaced gradient grid; using gradient direction associated with each gradient point to select a respective set of neighboring gradient points; comparing gradient magnitude associated with each gradient point with each gradient magnitude of the respective set of neighboring gradient magnitudes so as to determine which of the gradient magnitudes is a local maximum in approximately the gradient direction; and using the local maximum of gradient magnitude and a set of neighboring gradient magnitudes to determine an interpolated edge position along a one-dimensional gradient magnitude profile. Another aspect of the invention for providing two-dimensional edge position interpolation further includes the step of determining a plane position line normal to the gradient direction of a gradient point associated with the local maximum of gradient magnitude, the plane position line also passing through the interpolated edge position, along which plane position line at least one two-dimensional interpolated position of the edge can be determined.

Apparatus and method for detection and sub-pixel location of edges in a digital image

The invention provides boundary-based machine vision methods and systems for comparing a pattern to an image. These contemplate the steps of finding points on a boundary in the image; identifying one or more boundary features, at least one of which is made up of multiple such points; determining point-by-point relationships, if any, between each point defining the boundary feature in the image and points on a boundary in the pattern; and determining a relationship between the boundary feature in the image and the pattern (e.g., whether the boundary feature in the image matches a corresponding feature in the pattern) as a function of the point-by-point relationships.

Machine vision methods and systems for boundary feature comparison of patterns and images

An efficient and reliable method that identifies possible reference sites in an image is disclosed. The method emphasizes customizing the identification of reference sites for each application by providing for initialization of various parameters, such as the size of the reference site. The method then uses a series of measurable parameters to filter possible reference sites in the image and produces and ordered set of possible reference sites. The highest-ranking site of the ordered set is expected to be chosen as the reference site for production. A preferred implementation is disclosed that uses multi-resolution images to enhance efficiency of the identification and that specifically measures the symmetry, orthogonality and uniqueness of the windows.

Methods for finding peaks in a characteristic surface of an image

Apparatus and method for detecting and sub-pixel location of edges in a digital image

The invention provides boundary-based machine vision methods and systems for comparing a pattern to an image. These contemplate the steps of finding boundary points in the image and comparing those points with boundary points in the pattern to identify &ldquo;matches,&rdquo; i.e., boundary points in the image that match boundary points in the pattern, &ldquo;extras,&rdquo; i.e., boundary points in the image which do not match boundary points in the pattern, and &ldquo;missing,&rdquo; i.e., boundary points in the pattern that do not match boundary points in the image. Quantitative and/or qualitative information about matching, extra or missing points can be generated, including the differences between the locations, angles and contrasts of each boundary point in the image and the corresponding boundary point in the pattern.

Machine vision methods and system for boundary point-based comparison of patterns and images

A method and apparatus for determining the location and orientation of a reference feature in an image is provided. At train-time, a template image is created for use during the run-time phase. At run-time, a reference feature is located by first determining the principal angle of the reference feature. In a preferred embodiment, the principal angle &thgr; of the reference feature is found by partitioning the reference feature into a plurality of regions, projecting each of the regions at 0&deg;, and performing template matching with a template image to determine the position of a plurality of points along a principal axis of the reference feature. Then, either an equation of a &ldquo;best fit&rdquo; line can be calculated and solved simultaneously with an equation of a horizontal reference line, or the reference feature image can be projected at the angle of the &ldquo;best fit&rdquo; line to obtain a one-dimensional reference image which can be matched to the one-dimensional template image to find the relative displacement between them that maximizes a match-metric value. The invention is particularly useful for determining the location and orientation of reference feature images that have been degraded in some way. The invention provides substantial immunity to such image degradation by comprehensively exploiting image information derived from the entire image of the reference feature.

Apparatus and method for determining the location and orientation of a reference feature in an image

Method for automatic visual identification of a reference site in an image

An apparatus and method for two-dimensional search for a model image within atest image that exploits edge-based matching of edge maps, followed by area-based matching of at least coarse resolution edge maps of respective multi-resolution edge-maps, to efficiently and accurately provide the position of at least one instance of the model image. The invention can find a location of the model image within each test image of a sequence of test images, even when there are non-uniform brightness changes in the test image due to process steps or lighting changes. The postion of each verified instance of the model image within the test image can be provided to an alignment device, a measurement device, or any other device that can use such position information.

Robust search for image features across image sequences exhibiting

This invention provides a method and apparatus for automatically locating the bond of a wire to a lead frame and semiconductor chip or similar device as an in-process operation to facilitate in-process inspection. The apparatus includes a wire bonding machine, or similar apparatus, having a movable platform such as an X-Y table for holding semiconductor chips situated in lead frames; a video camera or other optical sensing or imaging device for generating images, which camera is typically positioned over the target chip and lead frame to be bonded; illumination means for illuminating the chip in a lead frame; an image processor capable of digitizing and analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform, the camera and the image processor. The apparatus generates and stores a pre-bond digital image of the semiconductor chip in the lead frame before bonding has occurred; connects one or more wires between the chip and lead frame by any of a number of means such as ultrasonic bonding, heat bonding, conductive glue bonding or other means; generates and stores a post-bond digital image of the now-bonded chip in its lead frame; registers the pre-bond and post-bond stored digital images so that analysis can be done; and permits inspection of the results of the wire bonds according to appropriate criteria.

Apparatus for automated optical inspection objects

This invention provides a method and apparatus for automatically inspecting the connection of a wire to a lead on lead frame containing a semiconductor chip or similar device. Using an image processor to locate the general position of a soldered lead in a digitized image, the present invention creates a template of an idealized optical indentation left by a good bond; determines parameters such as wire angle, idealized position and shape thresholds for applying the template; conducts a normalized correlation search of the digitized image; compares the results returned to the parameters and reports the resulting signals generated by this comparison to a host controller or other control module.

Method and apparatus to detect capillary indentations

This invention provides a method and apparatus for automatically locating the bond of a wire to a lead frame and semiconductor chip or similar device as an in-process operation to facilitate in-process inspection. The apparatus includes a wire bonding machine, or similar apparatus, having a movable platform such as an X-Y table for holding semiconductor chips situated in lead frames; a video camera or other optical sensing or imaging device for generating images, which camera is typically positioned over the target chip and lead frame to be bonded; illumination means for illuminating the chip in a lead frame; an image processor capable of summing said absolute difference values, whereby each sum is stored as a difference metric, and digitizing and analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform, the camera and the image processor. The apparatus generates and stores a pre-bond digital image of the semiconductor chip in the lead frame before bonding has occurred; connects one or more wires between the chip and lead frame by any of a number of means such as ultrasonic bonding, heat bonding, conductive glue bonding or other means; generates and stores a post-bond digital image of the now-bonded chip in its lead frame; registers the pre-bond and post-bond stored digital images using nearest neighbor interpolation so that analysis can be done; and permits inspection of the results of the wire bonds according to appropriate criteria.

Automated optical inspection apparatus

Method and apparatus for automatically locating the center of a ball bond of a wire to a lead frame and semiconductor chip or similar device; analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform. The present invention constructs a synthetic flattened cone model using a center radius, and monotonically increasing slope values to generate a model having a variation in grey levels, and inner and outer radii that will encompass expected size variations in a ball bond; sets a threshold for acceptable normalized correlation search results; acquires a digitized image of the bond, including a nominal location for the bond; conducts a normalized correlation search of the digitized image at the bond location, using the flattened synthetic cone model; and indicates the presence and location of the expected circular object as the location having the largest coefficient which exceeds a threshold.

Using cone shaped search models to locate ball bonds on wire bonded

This invention provides a method and apparatus for automatically locating the bond of a wire to a lead flame and semiconductor chip or similar device as an in-process operation to facilitate in-process inspection. The apparatus includes a wire bonding machine, or similar apparatus, having a movable platform such as an X-Y table for holding semiconductor chips situated in lead frames; a video camera or other optical sensing or imaging device for generating images, which camera is typically positioned over the target chip and lead flame to be bonded; illumination means for illuminating the chip in a lead flame; an image processor capable of digitizing and analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform, the camera and the image processor. The apparatus generates and stores a pre-bond digital image of the semiconductor chip in the lead flame before bonding has occurred; connects one or more wires between the chip and lead frame by any of a number of means such as ultrasonic bonding, heat bonding, conductive glue bonding or other means; generates and stores a post-bond digital image of the now-bonded chip in its lead frame; registers the pre-bond and post-bond stored digital images so that analysis can be done; and permits inspection of the results of the wire bonds according to appropriate criteria.

Growing community of inventors

Cambridge, MA, United States of America

Arman M Garakani