Tokyo Electron Limited

Arkalgud Sitaram

Jacques Faguet

Paul Abel

Christopher Netzband

The present disclosure provides a new wet atomic layer etch (ALE) process for etching copper. More specifically, the present disclosure provides various embodiments of methods that utilize new etch chemistries for etching copper in a wet ALE process. By utilizing the new etch chemistries disclosed herein within a wet ALE process, the present disclosure provides a highly selective etch of copper with monolayer precision.

Growing community of inventors

Albany, NY, United States of America

Arkalgud Sitaram