Input/output, Inc.

Inova Gmbh

Ion Geophysical Corporation

Arjun Selvakumar

Duli Yu

Howard D Goldberg

James L Marsh

Matthew W Ip

Martin Arnold Schmidt

Bing-Fai Fung

Philip Simon

Lianzhong Yu

W Marc Stalnaker

Ben William Jones

Peter Maxwell

Lawrence Philip Behn

Axel Michael Sigmar

Thomas M Buie

Guido Lemke

Wilfred Bertrand

Howard Goldberg

Hua Ai

Larry Rushefsky

Ray Rinne

Demetrios Balderes

Klaus Domagalski

David Morgan

Kees Faber

Sjoerd Altman

Richard Laroo

Taechung Yi

Ben Jones

A nodal seismic unit for acquiring seismic information includes an enclosure, a GPS receiver disposed in the enclosure; a motion sensor disposed in the enclosure; a LPWAN radio transceiver disposed in the enclosure; and a control unit disposed in the enclosure. The control unit is configured to transmit an unplanned movement signal to a remote operator using the LPWAN radio transceiver if the control unit receives a signal from the motion sensor indicative of an acceleration greater than a preset level. Additionally, the control unit may be configured to change an operating state of the nodal seismic unit in response to detecting a predetermined pattern of motion using the motion sensor.

Motion aware nodal seismic unit and related methods

Methods, apparatuses, and systems are disclosed for multi-station sensor strings. One example apparatus includes a sensor string. The sensor string includes a connector and a common data transmission channel configured to be in communication with a data acquisition unit through the connector. The sensor string also includes a first seismic sensor configured to provide sensed seismic data to the common data transmission channel, and a second seismic sensor also configured to provide sensed seismic data to the common data transmission channel.

Multi-station seismic sensor strings

An accelerometer () for measuring seismic data. The accelerometer () includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer () also includes a top cap press frame recess () and a bottom cap press frame recess () for isolating bonding pressures to specified regions of the accelerometer (). The accelerometer () is vacuum-sealed and includes a balanced metal pattern () to prevent degradation of the performance of the accelerometer (). A dicing process is performed on the accelerometer () to isolate the electrical leads of the accelerometer (). The accelerometer () further includes overshock protection bumpers () and patterned metal electrodes to reduce stiction during the operation of the accelerometer ().

Sensor design and process

The present invention provides a digital optical switch apparatus and process for manufacturing the apparatus. The apparatus includes a mirror assembly coupled to a top cap and to a bottom cap. The top and bottom caps each include one or more electrodes that, when energized with electrical energy, move a mirrored surface to one of a plurality of discrete positions. Mirror assemblies can be cascaded to create a packaged assembly having any multiple of discrete positions. The process includes planar micro-machining techniques to create isolated islands for electrical feed through. The process enables mechanical bonding of multiple tiers via a single bond region and through a bond-pad window.

Digital optical switch apparatus and process for manufacturing same

A sensor apparatus () includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module () supported by a planar surface () within a cavity () of a housing () coupled to a first end cap () by a PC-board connection (). Housing () is further coupled to first end cap () by a first coupling member () and a second coupling member () and is also coupled to an opposite second end cap () by a third coupling member () and a fourth coupling member (). Interface sealing members () seal between housing () and first end cap (). Interface sealing members () seal between housing () and second end cap ().

Integrated and multi-axis sensor assembly and packaging

A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.

Low stress die attachment

Disclosed is an accelerometer for measuring seismic data. The accelerometer includes a proof mass that is resiliently coupled to a support structure by folded beams, S-shaped balanced beams, straight beams, and/or folded beams with resonance damping. The support structure further includes travel stops for limiting transverse motion of the proof mass.

Accelerometer with folded beams

Growing community of inventors

Bellaire, TX, United States of America

Arjun Selvakumar