Adv Antest Corporation

Aritomo Kikuchi

Masataka Onozawa

Yuya Yamada

Hiroto Nakamura

Mitsunori Aizawa

Natsuki Shiota

Shigeo Nakamura

Yuki Endo

Tsuyoshi Yamashita

Masayoshi Ichikawa

Yasuyuki Kato

Hiromitsu Horino

Katsuhiko Ikeda

Jinji Tokita

A temperature adjusting device includes: a fluid connector connected to a fluid supply source; a heat exchanger thermally connected to a DUT or a carrier holding the DUT being pressed against a socket; a first flow path passing through an inside of the heat exchanger; a first swirl flow forming part that supplies a first swirl flow to the first flow path, the first swirl flow swirling along an inner surface of the first flow path around a first central axis of the first flow path; and a second flow path disposed on an upstream side of the first flow path and connected to the first flow path. The second flow path has a second central axis not intersecting the first central axis, and the first swirl flow forming part is a first connection part where the first and second flow paths are connected to each other.

Temperature adjusting device, electronic component handling apparatus, and electronic component test apparatus

A temperature control device controls a temperature of a device under test (DUT) including a device flow path in testing the DUT, and includes: a first flow path that has a first connection port to be connected to an inlet of the device flow path; and a fluid supply system that is connected to the first flow path and supplies a first fluid for temperature control to the device flow path.

Temperature control device, electronic component handling apparatus, electronic component test apparatus, and DUT temperature control method

An electronic component handling apparatus includes: a moving device that moves a device under test (DUT) including a first antenna and presses the DUT against a socket. The moving device includes a holder that holds the DUT and a second antenna that receives a radio wave radiated from the first antenna or that radiates the radio wave to the first antenna.

Electronic component handling apparatus, electronic component testing apparatus, and socket

An electronic component handling apparatus handles a device under test (DUT). The electronic component handling apparatus includes: a set plate that holds a DUT container including a plurality of pockets each of which accommodates the DUT; a sensor that acquires three-dimensional shape data of the DUT container; and a processor that corrects the shape data based on an inclination of the set plate, extracts a height and an inclination of a predetermined region corresponding to the DUT in a first pocket among the pockets, from the shape data corrected by the processor, and determines an accommodation state of the DUT in the first pocket based on an extraction result obtained by the processor.

Electronic component handling apparatus and electronic component testing apparatus

An electronic component handling apparatus includes: a thermostatic chamber in which a socket disposed, the socket electrically being connectable to a device under test (DUT) including a first antenna; a moving device that moves the DUT and presses the DUT against the socket; an anechoic chamber disposed adjacent to the thermostatic chamber; a second antenna disposed inside the thermostatic chamber; and a first window that transmits radio waves radiated from the first or second antenna. The thermostatic chamber has a first opening on a wall surface of the thermostatic chamber. The anechoic chamber has a radio wave absorber and a second opening that opens toward a transmission direction of the radio waves from or to the second antenna. The thermostatic chamber and the anechoic chamber are connected to each other to make the first opening and the second opening face each other.

Provided is a magnetic sensor testing device capable of preventing performance of an electromagnet from greatly changing due to heat applied to a magnetic sensor. A magnetic sensor testing device includes electromagnetsandthat apply a magnetic field to a magnetic sensor, temperature regulatorsandthat regulate a temperature of the magnetic sensor by locally applying heat to the magnetic sensor, and a controller that controls the electromagnetsandand the temperature regulatorsand, in which the controller tests the magnetic sensor in a state in which the magnetic field is applied to the magnetic sensor by the electromagnetsandwhile the heat is applied to the magnetic sensor by the temperature regulatorsand

Magnetic sensor testing device

An apparatus for detecting an attitude of electronic components. The electronic components include an electronic component having a plurality of terminals. The apparatus includes a storage and an image processor. The image processor is configured to: extract a binarized image from an image acquired by an imaging device; perform image matching between a terminal in the binarized image and a terminal in a model image to extract attitude candidates of image matching; obtain coordinates of a corner part of the plurality of terminals from the binarized image of the electronic component; select an attitude candidate from among the attitude candidates of image matching; and output the attitude candidate as a detected attitude of the electronic component.

Detector for detecting position of IC device and method for the same

Provided is a handler apparatus that conveys a device under test to a test socket, including: a socket for adjustment which, prior to fitting of a device holder holding the device under test to the test socket, fits the device holder; a socket-for-adjustment position detecting section that detects a relative position of the device under test with respect to the socket for adjustment, in a state in which the device holder fits the socket for adjustment; an actuator that adjusts a position of the device under test on the device holder, based on the detected relative position of the device under test; and a conveyer that conveys the device holder, in which a position of the device under test has been adjusted, to fit the test socket.

Handler apparatus that conveys a device under test to a test socket and test apparatus including the handler apparatus

There is provided an electronic component handling apparatus which can be reduced in size or can improve the throughput when the number of contact arms is increased. A handler comprises: a plurality of contact arms which are arrayed along a first direction, each of the plurality of contact arms including a holding part which holds a DUT and including an adjustment unit which moves the holding part relative to a base part of each contact arm; an imaging unit capable of imaging the DUT and the holding part; an operation unit which operates the adjustment unit; and a moving unit which moves the imaging unit and the operation unit along an X direction. The adjustment unit adjusts the relative position of the holding part according to an operation of the operation unit.

Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method

Provided is an actuator including: first to third rotation axes provided at a fixed section and having axes in a same direction, first to third rotation sections provided at positions offset from centers of the corresponding rotation axes, and rotating in response to the corresponding rotation axes; a movable section including first and third side walls facing the first and the third rotation sections in a first direction on a movable plane, and a second side wall facing the second rotation section in a second direction, the movable section moving on a predetermined movable plane in response to rotation of the first to third rotation sections; and a biasing section biasing the movable section with respect to the fixed section in at least one of the first direction and the second direction, and making at least one of the first to third rotation sections abut against the corresponding side wall.

Actuator, handler apparatus and test apparatus

An electronic device handling apparatus, which handles an electronic device under test having a first main surface provided thereon with first device terminals and a second main surface provided thereon with second device terminals, includes: a contact arm having a holding-side contact arm to which a first socket is attached and a suction pad which holds the electronic device under test; an alignment apparatus which positions the first socket and the electronic device under test; and the alignment apparatus which positions, with respect to a second socket, the electronic device under test being held by the suction pad and contacting the first socket, wherein the contact arm presses the second device terminals of the electronic device under test to the second socket.

In an electronic device test apparatus using image processing technology to position an IC device relative to a socket, a calibration method of an electronic device test apparatus of calibrating a relative position of a device camera with respect to a socket, the method comprising: calculating an offset amount of a socket guide with respect to the socket on the basis of a relative position of the socket camera with respect to the socket guide and a relative position of a socket camera with respect to the socket; and adding this offset amount to the relative position of the device camera with respect to the socket guide so as to calculate the relative position of the device camera with respect to the socket.

Calibration method of electronic device test apparatus

A position detecting apparatus for detecting a position of an electronic component, which includes a terminal, includes an image acquiring unit for acquiring an image of the terminal, a terminal area detecting unit for detecting an area of the terminal from the image acquired by the image acquiring unit and an electronic component position detecting unit for detecting a position of the electronic component based on the area of the terminal detected by the terminal area detecting unit and predetermined terminal information of the electronic component.

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Tokyo, Japan

Aritomo Kikuchi