Molex Corporation

Arindum Dutta

John E Lopata

James L McGrath

Augusto P Panella

David L Brunker

Daniel L Dawiedczyk

Marvin Menzin

Daniel Fisher, Jr

Jeoffrey Urbanowski

A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.

Power delivery to base of processor

Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.

Grouped element transmission channel link termination assemblies

An engineered transmission line for transmitting high-frequency data signals between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body. Enlarged conductive surfaces may also be provided on the body which have a greater surface area than those intended for use with the signal channels. The enlarged surfaces are utilized to carry power.

Differential transmission channel link for delivering high frequency signals and power

A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.

Method of making stitched LGA connector

Stitched LGA connector

A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents.

Power delivery connector for integrated circuits utilizing integrated capacitors

Systems for power delivery to an integrated circuit include a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system delivers power to the IC along various surfaces thereof by way of a plurality of discrete capacitors that are supported by a socket-style connector. The socket-style connector has an insulative body portion that is mounted to a circuit board and has a recess defined thereon that receives the IC therein. A plurality of capacitors are integrated with the body portion and, each of the capacitors supplies a desired amount of power to the IC. The capacitors are charged by way of leads on the circuit board that bring power to current to the capacitors and then are discharged as the IC draws power from the socket such that the capacitors form a power reservoir integrated with the socket, thereby eliminating the need for mounting such capacitors on the circuit board near the IC and freeing up space on the circuit board.

Power delivery system for integrated circuits utilizing discrete capacitors

A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The power reservoir is integrated into a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least one opening that opens up to a operational surface of the integrated circuit. A heat-dissapating device, such as a finned heat sink or the like is supported by the cover member and extends through its opening into contact with a heat-generating surface of the integrated circuit to cool it during operation.

Growing community of inventors

Warrenville, IL, United States of America

Arindum Dutta