Rockley Photonics Limited

Mellanox Technologies Silicon Photonics Inc.

Arin Abed

Omar James Bchir

Thomas Pierre Schrans

Chia-Te Chou

Gerald Cois Byrd

Aaron John Zilkie

Erman Timurdogan

Scott Benjamin Golper

William Dos Santos Fegadolli

An optoelectronic module. In some embodiments, the optoelectronic module includes a substrate; a digital integrated circuit, on an upper surface of the substrate; a photonic integrated circuit, secured in a pocket of the substrate, the pocket being in the upper surface of the substrate; and an analog integrated circuit, on the photonic integrated circuit.

Optoelectronic module package

An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.

A method of forming an optical device includes obtaining a wafer having multiple optical device dies that each includes a waveguide. The method also includes forming a facet on the waveguide of different dies. The method further includes separating the dies from the wafer after forming the facets. The dies are separated from the wafer such that the facets are positioned at an edge of the dies.

Edge construction on optical devices

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Glendale, CA, United States of America

Arin Abed