Nec Corporation

Nec Platforms, Ltd.

Arihiro Matsunaga

Minoru Yoshikawa

Masaki Chiba

Kenichi Inaba

Akira Shoujiguchi

Hitoshi Sakamoto

Masanori Sato

Koichi Todoroki

Hisato Sakuma

Tadao Hosaka

Shunsuke Fujii

Mizuki Wada

A cooling system including a vaporizer configured to absorb heat due to a liquid-phase refrigerant being vaporized, a condenser configured to discharge heat due to a refrigerant in a gaseous phase state being liquefied, a resistance body provided in a middle of a pipe passage ranging from the vaporizer to the condenser and applying a resistance to the refrigerant, state detection sensors provided in the pipe passage on an upstream and downstream sides of the resistance body and detecting a state of the refrigerant flowing through each side inside the pipe passage, and a flow rate controller configured to detect droplets in the refrigerant flowing through the pipe passage on the basis of a difference between detection values of the state detection sensors which are detected on the upstream and downstream sides of the resistance body, and controls a flow rate of the refrigerant on the basis of detection results.

Cooling system and refrigerant control method for cooling system

A valve control device includes a receiving unit, an opening degree control unit, and a fixing control unit. The receiving unit receives information concerning the measured temperature of a fluid to be cooled that is cooled by a vaporizer in a refrigerant circulation path that is equipped with the vaporizer and a condenser. The opening degree control unit variably controls the opening degree of a valve that controls the flow rate of the refrigerant that circulates through the circulation path in accordance with the difference between the measured temperature and a target temperature provided in advance. The fixing control unit fixes the opening degree of the valve with priority over variable control performed by the opening degree control unit in the case where a fixing condition based on the difference between the measured temperature and the target temperature and a valve opening degree variation condition is satisfied.

Valve control device, cooling device, and valve control method

The present invention provides a heat exchanger including a lower header into which a liquid-phase refrigerant flows, a plurality of heat exchange pipes which branch off from the lower header and extend upwards, and an upper header which is configured to collect refrigerant received by the heat exchange pipes, in which a refrigerant inlet of the lower header is provided with a flow passage resistance adjusting hole having a cross-section smaller than a flow passage cross-section of a pipe passage for supplying the refrigerant.

Heat exchanger, heat exchange system, and heat exchange method

It is impossible to avoid the increase in device cost and maintenance cost in order to cool a plurality of heat sources efficiently using a natural-circulation type phase-change cooling device; therefore, a phase-change cooling device according to an exemplary aspect of the present invention includes a plurality of heat receiving units configured to hold respectively refrigerant receiving heat from a plurality of heat sources; a condensing unit configured to generate refrigerant liquid by condensing and liquefying refrigerant vapor of the refrigerant evaporated in the heat receiving units; a refrigerant vapor transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant vapor; and a refrigerant liquid transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant liquid, wherein the refrigerant liquid transport structure includes a main-liquid-pipe connected to the condensing unit, a refrigerant liquid reservoir connected to the main-liquid-pipe and configured to store the refrigerant liquid, and a plurality of sub-liquid-pipes respectively connecting the refrigerant liquid reservoir to the plurality of heat receiving units.

Phase-change cooling device and phase-change cooling method

With a phase change cooling device, it is difficult to obtain reliable high-efficiency cooling performance due to a change in heat exchange performance. Thus, a phase change cooling device according to the present invention includes: a heat receiving apparatus that houses a coolant; a sensor that acquires heat receiving apparatus coolant information that is information relating to a liquid-gas two-phase flow interface of the coolant housed in the heat receiving apparatus; a radiator that radiates heat of coolant vapor of the coolant heat-received and evaporated in the heat receiving apparatus, and recirculates liquefied coolant liquid to the heat receiving apparatus; a valve that controls a flow rate of the coolant liquid; and a control unit that controls a degree of opening of the valve, wherein the control unit controls, based on the heat receiving apparatus coolant information, a degree of opening of the valve in such a way that a liquid-gas two-phase flow interface of the coolant is located at an end part of the heat receiving apparatus in a vertical direction.

Phase change cooling device and phase change cooling method

In order to supply a refrigerant to multiple-stage heat receivers equally while saving space, a refrigerant distribution device to distribute a refrigerant supplied from the upper stream according to the present invention includes a main body including a side wall part, an upper face part and a bottom face part, an upstream pipe provided on the upper face part in a manner communicating with an inside of the main body, a downstream pipe provided in a state partially inserted inside the main body via an under face hole part provided in the bottom face part, a tributary pipe provided in the side wall part or the bottom face part in a manner communicating with the inside of the main body, and a refrigerant direction changing means provided between the upstream pipe and the downstream pipe.

Refrigerant distribution device and cooling apparatus

A vapor pipeconnects a heat dissipation portionand each of a plurality of heat receiving portions. A liquid pipeconnects the heat dissipation portionand each of a plurality of the heat receiving portions. A bypass pipeconnects the vapor pipeand the liquid pipe. A valveopens and closes a flow path of the bypass pipe. A first connection portionconnects the vapor pipeand the bypass pipe. A second connection portionconnects the liquid pipeand the bypass pipe. The first connection portionis disposed at a position higher than that of the second connection portion. As a result, refrigerant can be efficiently transported in a short time.

Electronic apparatus enclosure device and electronic apparatus cooling system

An electronic boardhas a heat generating componentmounted on it. An enclosurehouses the electronic board. A heat transport unitis coupled to the enclosureand transports heat generated by the heat generating componentto the outside. A heat receiving unitis provided in a heat transport unitA. The heat receiving unitreceives heat generated by the heat generating component. A heat dissipating unitis provided in the heat transport unitin such a manner that a portion of the heat dissipating unitis exposed to outside air, and is coupled to the heat receiving unit. The heat dissipating unitdissipates heat received by the heat receiving unitto the outside. A guide duct unitis formed into a tube interconnecting the heat generating componentand the heat receiving unitin order to release heat of the heat generating componentto the heat receiving unit. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.

Electronic device and cooling system

In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

Cooling apparatus, heat receiving section and boiling section used therein, and method of manufacturing the same

A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer.

Cooling system for electronic device storing apparatus and cooling system for electronic device storing building

A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

Cooling apparatus and cooling system

It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Connecting structure of cooling device, cooling device, and method for connecting cooling device

A vapor phase cooling apparatus () includes: a housing () including a heat receiver () configured to receive heat generated by an electronic component () that is a heat generating source, the electronic component () being connected to a vertical outer surface on the +Z side of the housing, the housing including an internal space for enclosing refrigerant; and a first heat sink () and a second heat sink () that are disposed on the +Y side and the &#x2212;Y side from the electronic component () and that dissipate heat to the outside. Both ends of the first heat sink () and the second heat sink () in X direction extend further along the surface on the +Z side than both ends of the heat receiver () in X direction.

Vapor phase cooling apparatus and electronic equipment using same

An electronic substrate has a tabular base material which can install a heater element and a cooling structure that cools the heater element. The electronic substrate can be plugged in/out in a case in the direction which is almost parallel to the face of the base material. The cooling structure has a first heat radiation part with a hollow shape and a heat transfer part. The first heat radiation part radiates the generated heat of a heater element installed in the base material. A heat transfer part transfers the generated heat to the first heat radiation part. The first heat radiation part has a first joint surface formed along a face which is almost vertical to the insert and removal direction of the base material. The first heat radiation part is connected to a second radiation part set up in the case thermally through the first joint surface.

Electronic substrate and an electronic apparatus

A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.

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Tokyo, Japan

Arihiro Matsunaga