Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

San Diego State University Research Foundation

Kyocera International, Inc.

Arif Ege Engin

Ivan Ndip

Klaus-Dieter Lang

Gerardo Aguirre

Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.

Growing community of inventors

San Diego, CA, United States of America

Arif Ege Engin