Ati Technologies Ulc

Advanced Micro Devices Products (china) Co., Ltd.

Arie Margulis

Yuan Chao

Tassanee Payakapan

A multi-die integrated circuit uses an on-chip test distribution module to distribute test data to different dies, such as processor chiplets. The test distribution module receives test input data from an external source via one or more integrated circuit pins and distributes the test input data to the different dies, such that the different dies are able to concurrently apply the test data to one or more circuits. Based on application of the test input data the different dies concurrently generate corresponding test results that are used to identify and address design or operation errors at the dies.

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Markham, Canada

Arie Margulis