Core Flow Ltd.

Steag C.v.d. Systems Ltd.

Coreflow Scientific Solutions Ltd.

Streag Cvd Systems Ltd

Arie Harnik

Yuval Yassour

Hilel Richman

Boaz Nishri

Oded Yehoshua Licht

Oded Hamburger

Alla Soudakovitch

Shay Levavy

Itai Bransky

Eliezer Iskevitch

Igor Fidelman

Michael Sandler

Elie Schwarzfuchs

Gil Kohav

A non-contact support platform system is provided for supporting a substantially flat object. The system includes a platform with a first plurality of pressure ports and a first plurality of vacuum ports for inducing a fluid cushion to support the object at a distance from the platform. The system further includes a second plurality of pressure ports located at a predetermined zone of the platform for increasing the distance of the object from the platform at the predetermined zone.

Method and system for locally controlling support of a flat object

An apparatus for supporting a stationary or moving substantially flat object without physical contact on an fluid-cushion. The object floats on a fluid cushion gap, the apparatus aimed for globally or locally adjusting the gap. The apparatus comprising: a first platform for supporting the object without contact, the platform having a substantially flat active surface comprised of one or more sectors, each sector comprising at least one of a plurality of basic cells, each basic cell having at least one of a plurality of pressure outlets fluidically connected through a pressure flow restrictors to a higher-pressure manifold associated with the sector in which the basic cell lies, the higher-pressure manifold is fluidically connected through main supply pipeline to pressurized fluid supply and at least one of a plurality of fluid-evacuation channels fluidically connected to a lower-pressure manifold associated with the sector in which the basic cell lies having main evacuation pipeline; wherein the flow restrictor characteristically exhibiting fluidic return spring behavior; and wherein at least one pressure control valve is interposed with at least one of the two main pipelines of at least one sector for controlling pressure levels of at least one of the two manifolds of that sector.

Non-contact support platforms for distance adjustment

A thermal treatment system comprising at least one apparatus for thermally treating an object, the apparatus comprising: one platform or two substantially opposite platforms, where at least one of the platforms has at least one thermal means for heating or cooling of the object; and at least one of the platforms has fluid-mechanical means for supporting the object without contact. The platform has an active surface comprising at least one of a plurality of basic cells, each basic cell having at least one of a plurality of pressure outlets and at least one of a plurality of fluid-evacuation channels. At least one of the pressure outlets of each basic cell is fluidically connected through a flow restrictor to a high-pressure fluid supply, the pressure outlets providing pressurized fluid for maintaining a fluid-cushion between the object and the active-surface of the platform. The flow restrictor characteristically exhibits fluidic return spring behavior. Each of the evacuation channels has an inlet and outlet, for locally balancing mass flow for the basic cells.

Non-contact thermal platforms

A method and apparatus for selectively depositing hemispherical grained silicon on the surface of a wafer in a process chamber. The chamber is evacuated so that a partial pressure of water vapor in the chamber is less than 10 torr, preferably using a turbomolecular pump and a water vapor pump in cooperation. A process gas mixture including silicon is introduced into the chamber. The surface of the wafer is seeded with silicon nuclei, and the wafer is annealed to convert the silicon to HSG.

Wafer processing with water vapor pumping

Semiconductor processing apparatus, including a chamber, into which a semiconductor wafer is introduced for processing thereof and a heater, which heats the wafer in the chamber. A radiation guide collects thermal radiation from a selected region of the wafer. A wafer support assembly supports the wafer and shields the radiation guide from radiation other than radiation from the region. A pyrometer, coupled to receive the radiation from the guide, analyzes the radiation to determine a temperature of the region, for use in controlling the processing.

Apparatus for processing material at controlled temperatures

A method and apparatus are described for increasing the temperature uniformity of a wafer heated in a rapid thermal process (RTP) while the wafer is supported by a high emissivity structure in spaced relation above the head during the heating of the wafer; characterized in that a high-reflectivity ring, highly reflective to the radiation of the wafer, is provided on the head underlying the high emissivity ring.

Method and apparatus for increasing temperature uniformity of heated

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Haifa, Israel

Arie Harnik