Corning Incorporated

Aric Bruce Shorey

Garrett Andrew Piech

Charles Michael Darcangelo

David Alan Tammaro

Steven Edward DeMartino

John Christopher Thomas

John T Keech

Daniel Wayne Levesque, Jr

Daniel Duane Strong

Paul John Shustack

Xinghua Li

Butchi Reddy Vaddi

Jeffrey John Domey

Yuhui Jin

Kevin Lee Wasson

Robert Stephen Wagner

Darwin Gene Enicks

Raymond Charles Cady

Ekaterina Aleksandrovna Kuksenkova

Windsor Pipes Thomas, Iii

Andres Covarrubias Jaramillo

Frank Andrew Kramer, Iv

Joseph Fabian Ellison

Richard A Nasca

Mihir Mahendra Shah

John Tyler Keech

Frank Andrew Iv Kramer

Windsor Pipes Iii Thomas

A process comprises bonding a semiconductor wafer to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. After the bonding, a damage track is formed in the inorganic wafer using a laser that emits the wavelength of light. The damage track in the inorganic wafer is enlarged to form a hole through the inorganic wafer by etching. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer. An article is also provided, comprising a semiconductor wafer bonded to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. The inorganic wafer has a hole formed through the inorganic wafer. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer.

Inorganic wafer having through-holes attached to semiconductor wafer

A thin sheet () disposed on a carrier () via a surface modification layer () to form an article (), wherein the article may be subjected to high temperature processing, as in FEOL semiconductor processing, not outgas and have the thin sheet maintained on the carrier without separation therefrom during the processing, yet be separated therefrom upon room temperature peeling force that leaves the thinner one of the thin sheet and carrier intact. Interposers () having arrays () of vias () may be formed on the thin sheet, and devices () formed on the interposers. Alternatively, the thin sheet may be a substrate on which semiconductor circuits are formed during FEOL processing.

Carrier-bonding methods and articles for semiconductor and interposer processing

A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

Work piece including a sacrificial cover layer for laser drilling substrates

Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Rthat is less than or equal to 1 &#x3bc;m. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.

Articles having holes with morphology attributes and methods for fabricating the same

Sacrificial cover layers for laser drilling substrates and methods thereof

An edge finishing apparatus includes a surface, a fluid delivery device configured to deliver at least one magnetorheological polishing fluid (MPF) ribbon to the at least one well, at least one magnet placed adjacent to the surface to selectively apply a magnetic field in a vicinity of the surface, and at least one holder placed in opposing relation to the surface, the at least one holder being configured to support at least one article such that an edge of the at least one article can be selectively immersed in the MPF ribbon delivered to the at least one well.

Edge finishing apparatus

Methods of finishing an edge of a glass sheet comprise the step of machining the edge of the glass sheet into a predetermined cross-sectional profile along a plane taken transverse to the edge of the glass sheet with an initial average edge strength ES. The methods also include the step of finishing the edge with at least one finishing member, such as an endless belt, without substantially changing a shape of the predetermined cross-sectional profile. In one example, a wet slurry including an abrasive can be applied to at least one of a finishing member and the edge of the glass sheet. After finishing the edge, example finished average edge strengths EScan be at least about 250 MPa. In addition or alternatively, in another example, the ratio ES/EScan be within a range of from about 1.6 to about 5.6.

Methods of finishing an edge of a glass sheet

A method of preparing an edge-strengthened article comprises polishing of an edge of an article having a first edge strength using magnetorheological finishing, wherein after the polishing the article has a second edge strength and the second edge strength is greater than the first edge strength.

Method of preparing an edge-strengthened article

A method for screening abrasive wheels for fabricating a honeycomb extrusion die from a die body, and methods for fabricating a honeycomb extrusion die using an abrasive wheel assembly. One method for fabricating a honeycomb extrusion die includes measuring at least one of runout and thickness of each of a plurality of abrasive blades while rotating the blades, selecting a subset of the plurality of blades that have a measured runout or a measured thickness within a predetermined range, and mounting the subset of blades spaced from one another and concentrically aligned along a rotation axis of the abrasive wheel assembly.

Methods of fabricating a honeycomb extrusion die from a die body

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Painted Post, NY, United States of America

Aric Bruce Shorey