U.S. Philips Corporation

Arian Molenaar

Peter E Wierenga

Godefridus H Heijnen

Jan Boven

Hendrik Jonker

Henricus M Van Den Bogaert

Producing metal images or patterns on and/or below the surface of a substrate material comprising a semiconducting light-sensitive compound, such as titanium dioxide or zinc oxide which after exposure of a metal compound releases this metal in the form of nuclei. Exposure takes place in the solution of the metal compound by means of a moving beam of laser light whereby the nuclei pattern is directly 'written'. Thereafter, the nuclei image is intensified in known manner to produce a visible image or a conductive pattern, for example by means of an electroless plating solution. Use: the recording of information as well as the production of printed circuit boards.

Method of producing metal images or patterns on and/or below the surface

Method of currentless deposition of tin on a catalytic surface by means of a highly alkaline solution which contains stannous ions in a quantity of at least 0.20 mole/l and is used at temperatures of 60.degree. to 90.degree. C. The solution operates on the basis of the mechanism of disproportioning of stannous ions. The tin deposition is, however, accelerated by means of a strong reducing agent such as a hypophosphite.

Bath for electroless depositing tin on substrates

A copper-plating bath suitable for reprographic uses and for making electrically conducting metal patterns with one of the redox pairs V.sup.2+ /V.sup.3+, Ti.sup.2+ /Ti.sup.3+, or Cr.sup.2+ /Cr.sup.3+ as a reducing agent, ascorbic acid with an acid acceptor, or the redox pair Fe.sup.2+ /Fe.sup.3+ together with an organic carboxylic acid and a complexing agent for cuprous ions.

Universal copper-plating solution

Electroless copper plating bath containing a copper salt, a complexing agent, alkali and by way of reducing agent a complex of formaldehyde with an aminocarboxylic acid, -sulphonic acid or -phosphonic acid. Consequently, decomposition of the bath is greatly reduced and furthermore copper of a superior quality is obtained.

Electroless copper plating solutions

A solution for the selective electroless deposition of silver comprising as essential constituents silver salt, ammonium hydroxide and a reducer chosen from tartrate, formaldehyde or hydrazine and an organic compound having one or more cyclic or polar aliphatic groups on the one hand and an SH-group on the other hand.

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Eindhoven, Netherlands

Arian Molenaar