Corning Incorporated

Primet Precision Materials, Inc.

Archit Lal

Daniel Warren Hawtof

Daniel Aloysius Nolan

Wageesha Senaratne

Xinghua Li

Pamela Arlene Maurey

Robert J Dobbs

Steven Edward DeMartino

Gary Richard Trott

William Judson Ready

Brent Karl Wagner

Hisham Menkara

Jen-Chieh Lin

Windsor Pipes Thomas, Iii

Kevin William Uhlig

Daniel L Maurey

A method for processing material includes sintering a portion of a sheet of material at a location on the sheet, moving the sintering location along the sheet of material at a first rate, and pulling the sintered material away from the sintering location at a second rate that is greater than the first rate.

Process for sintering material

Disclosed herein are OLED devices comprising waveguides including at least one waveguide layer comprising at least one inorganic nanoparticle and at least one binder and having an RMS surface roughness of less than about 20 nm. Lighting and display devices comprising such OLED devices are further disclosed herein as well as methods for making the waveguides.

Waveguides comprising light extraction nanostructures and display devices comprising the same

A high silica content substrate, such as for a thin-film battery, is provided. The substrate has a high silica content, such as over 90% by weight silica, and is thin, for example less than 500 &#x3bc;m. The substrate may include a surface with a topography or profile that facilitates bonding with a coating layer, such as a coating of an electrochemical battery material. The high silica content substrate may be flexible, have high temperature resistance, high strength and/or be non-reactive. The substrate may be suitable for use in the high temperature environments used in many chemical deposition or formation processes, such as electrochemical battery material formation processes.

High silica content substrate such as for use in thin-film battery

A high silica content substrate, such as for a device, is provided. The substrate has a high silica content and is thin. The substrate may include a surface with a topography or profile that facilitates bonding with a conductive metal layer, such as a metal layer for a circuit or antenna. The substrate may be flexible, have high temperature resistance, very low CTE, high strength and/or be non-reactive. The substrate may be suitable for use in circuits intended for use in high temperature environments, low temperature environments, reactive environments, or other harsh environments. The substrate may be suitable for high frequency antenna applications.

Silica content substrate such as for use harsh environment circuits and high frequency antennas

A method of making an LED device and an LED device using a high-silica, fully-sintered glass substrate is provided. The high-silica substrate is at least 99% silica and is thin, such as less than 200 &#x3bc;m in thickness. A phosphor containing layer is deposited on to the substrate and is laser sintered on the substrate such that a portion of the sintered phosphor layer embeds in the material of the substrate.

Method of forming light emitting diode with high-silica substrate

An assembly, such as for growing carbon nanotubes, includes a substrate including SiOand has a thickness of less than 500 &#x3bc;m. Further, the substrate is bendable and has a surface with non-flat or non-polished texture such that surface comprises raised and recessed features for receiving a coating, such as a catalyst. Carbon nanotubes may be anchored to and grow from the recessed features of the substrate.

Substrate such as for use with carbon nanotubes

Small particle compositions including nanoparticle compositions are provided. The particle compositions, in some cases, are characterized by having an extremely small average particle size (e.g., 150 nanometers or less). The small particles may comprise a semiconductor material and/or a light-emitting material. In some embodiments, the particles may be in the form a preferred shape including platelets, amongst others. The small particle compositions may be produced in a milling process. In some embodiments, the milling process uses preferred types of grinding media to form milled particles having desired characteristics (e.g., particle size, shape). The small (or nano) particle compositions may be used in a variety of different applications including light-emitting applications. In certain applications, it may be desirable to form thin films from the small particle compositions.

Milled particle compositions and related methods and structures

Lithium-based compound small particle compositions, as well as methods and structures associated with the same, are provided. The particle compositions, in some cases, are characterized by having an nano-size particles. The particle compositions may be produced in a milling process. In some embodiments, the particles may be coated with a coating that may enhance certain properties of the particle composition (e.g., electrical conductivity).

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Ithaca, NY, United States of America

Archit Lal