Sandisk Technologies Inc.

Arata Okuyama

Jixin Yu

Kengo Kajiwara

Motoki Kawasaki

Xun Gu

Ryo Urakawa

Hiroshi Omi

A three-dimensional memory device includes a pair of alternating stacks of insulating layers and electrically conductive layers located over a semiconductor region, and laterally spaced from each other by a backside trench, memory stack structures extending through the pair of alternating, each memory stack structure containing a vertical semiconductor channel and a memory film, and a backside contact assembly located in the backside trench. The backside contact assembly includes an isolation dielectric spacer contacting the pair of alternating stacks, a conductive liner contacting inner sidewalls of the isolation dielectric spacer and a top surface of the semiconductor region, and composite non-metallic core containing at least one outer dielectric fill material portion that is laterally enclosed by a lower portion of the conductive liner and a dielectric core contacting an inner sidewall of the at least one outer dielectric fill material portion.

Memory die containing stress reducing backside contact via structures and method of making the same

An integrated circuit such as a NAND flash memory includes a dielectric layer overlying transistors (e.g. NAND flash memory cells) that are formed along a surface of a substrate and a hydrogen absorption structure overlying the dielectric layer, the hydrogen absorption structure extending over the transistors, the hydrogen absorption structure being electrically isolated from the transistors.

Integrated circuit with hydrogen absorption structure

Growing community of inventors

Nagoya, Japan

Arata Okuyama