Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Arata Kishi

Naomichi Ohashi

Atsushi Yamaguchi

Hiroki Maruo

Hidenori Miyakawa

Koji Motomura

Hironori Munakata

Yasuhiro Suzuki

Kenichiro Suetsugu

Kimiaki Nakaya

Hirohisa Hino

Takayuki Higuchi

Honami Nawa

Tadahiko Sakai

Shigeaki Sakatani

Tadashi Maeda

Hisahiko Yoshida

Yuki Yoshioka

Seiji Tokii

Masato Udaka

Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group.

Resin composition, anisotropic conductive film including the same, and electronic device

A connecting method of a circuit member, includes: a first process of preparing a connection material that a solder material disperses in the adhesive; a second process of disposing the first circuit member and the second circuit member to cause the first electrode of the first circuit member and the second electrode of the second circuit member to oppose each other via the connection material; and a third process of compressing the first circuit member and the second circuit member while applying heat to the connection material. The third process includes a first pressing process which is performed before a temperature of the connection material reaches a melting point of the solder material, and a second pressing process which follows the first pressing process.

Connecting method of circuit member

There is provided a conductive particle including a core particle containing a resin material, and a surface layer that covers a surface of the core particle and contains a solder material, in which a melting point of the solder material is equal to or lower than a softening point of the resin material.

Conductive particle, and connection material, connection structure, and connecting method of circuit member

Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 &#x3bc;m to 20 &#x3bc;m; and a filler having a grain diameter of 15 &#x3bc;m or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 &#x3bc;m to 20 &#x3bc;m.

Heat-dissipating resin composition, and component and electronic device including the same

A mounting structure includes a bonding material () that bonds second electrodes () of a circuit board () and bumps () of a semiconductor package (), the bonding material () being surrounded by a first reinforcing resin (). Moreover, a portion between the outer periphery of the semiconductor package () and the circuit board () is covered with a second reinforcing resin (). Even if the bonding material () is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

Mounting structure and method for manufacturing same

There is provided a connection structure of a circuit member including: a first circuit member having a first main surface provided with a first electrode; a second circuit member having a second main surface provided with a second electrode; and a joining portion which is interposed between the first main surface and the second main surface, in which the joining portion has a solder portion which electrically connects the first electrode and the second electrode to each other, in which the solder portion contains a bismuth-indium alloy, and in which an amount of bismuth contained in the bismuth-indium alloy exceeds 20% by mass and is equal to or less than 80% by mass.

Connection structure and connecting method of circuit member

A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

Connection structure of circuit member, connection method, and connection material

In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes low, when the first mounted substrate is bonded to the second substrate by using a solder having a low melting point. A mounted structure, in which a first mounted substrate on which a semiconductor element is bonded by using a first solder having a melting point of 217&#xb0; C. or more, is mounted on a second substrate, includes plural bonding parts bonding the first mounted substrate to the second substrate; and a reinforcing member formed around the bonding part. Each of the bonding parts contains a second solder having a melting point, that is lower than the melting point of the first solder, and a space exists, in which the reinforcing members do not exist, between the bonding parts neighboring each other.

Mounted structure and manufacturing method of mounted structure

A semiconductor package component () is mounted on a substrate () in such a manner that an electrode () of the substrate () and an electrode of the semiconductor package component () are brought into contact with each other through a joining material (). A reinforcing adhesive () is applied between the substrate () and the outer surface of the semiconductor package component (). Then, reflow is performed to melt the joining metal () with the reinforcing adhesive () uncured. After the reinforcing adhesive () is cured, the joining metal () is solidified.

Mounting method and mounting structure for semiconductor package component

A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity &#x3bb; of the heat conduction layer is 1.0 W/(m&#xb7;K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity &#x3b5; of the heat radiation layer is 0.7 or more.

Cooling structure

A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.

Method and system for producing component mounting board

A conductive adhesive includes 10 to 90 wt % of Sn&#x2014;Bi system solder powder and the remainder of an adhesive containing organic acid, and the Sn&#x2014;Bi system solder powder is composed of solder particles having a particle size Lof 20 to 30 &#x3bc;m and solder particles having a particle size Lof 8 to 12 &#x3bc;m, and a mixing ratio of the Sn&#x2014;Bi system solder powder is such that the solder particles having a particle size of 20 to 30 &#x3bc;m occupy 40 to 90 wt % with respect to the whole solder powder, and the remainder is occupied by solder particles having a particle size of 8 to 12 &#x3bc;m.

Conductive adhesive, and circuit board and electronic component module using the same

Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

Electrically conductive paste, and electrical and electronic device comprising the same

A semiconductor device mounted structure includes a semiconductor device having a plurality of first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.

Growing community of inventors

Osaka, Japan

Arata Kishi