Mitsubishi Electric Corporation

Arata Iizuka

Korehide Okamoto

Takeshi Omaru

Hideo Komo

Seiichiro Inokuchi

Ryoya Shirahama

Yuji Imoto

Shoji Saito

Khalid Hassan Hussein

Takahiko Murakami

Natsuki Tsuji

Ryoji Murai

Hiroya Sannai

Katsuji Ando

An object of the present invention is to provide a technique capable of reducing a gap between a first semiconductor device and a second semiconductor device that are bonded. At least one of a pair of a first electrode of the first semiconductor device and a second electrode of the second semiconductor device and a pair of a second electrode of the first semiconductor device and a first electrode of the second semiconductor device is electrically connected, and for each of the first semiconductor device and the second semiconductor device, each of a thickness of a portion from a first connected portion to a second connected portion and a thickness of a holding member are equal to or less than a thickness of a first main body portion or a thickness of a second main body portion.

Semiconductor device

A semiconductor device includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a case made of resin, the case being mounted on the heat sink and containing the semiconductor element. A fastening hole is formed passing through the case and the heat sink. The case includes a surface pressure absorbing member on a portion including the fastening hole in plan view, the surface pressure absorbing member having a plate shape and being higher in rigidity than the resin.

Semiconductor device including surface pressure absorbing member for fastening heat sink

An insulating substrate () is provided on a base plate (). A semiconductor device (-) is provided on the insulating substrate (). A case () is arranged to surround the insulating substrate and the semiconductor device and bonded to the base plate () with an adhesive (). A sealant () seals the insulating substrate and the semiconductor device in the case (). A groove () is provided on a lower surface of the case () opposing an upper surface peripheral portion of the base plate (). A bottom surface of the groove () has a protruding part () protruding toward the base plate (). The protruding part () includes a vertex () and gradients () respectively provided on an inner side and on an outer side of the case () with the vertex () sandwiched therebetween. The adhesive () contacts the vertex () and is housed in the groove ().

Semiconductor module

A first heat sink has a first inner surface and a first outer surface, and has a first through hole. A second heat sink has a second inner surface disposed with a clearance left from the first inner surface of the first heat sink, and a second outer surface opposite to the second inner surface, and has a second through hole. A semiconductor element is disposed within a clearance between the first inner surface of the first heat sink and the second inner surface of the second heat sink. A sealing member seals the semiconductor element within the clearance between the first inner surface and the second inner surface. A first hollow tube is made of metal, and connects the first through hole and the second through hole.

The present invention is intended to provide a semiconductor module and a semiconductor device that are compatible with various rated currents. A semiconductor module includes a lead frame, and a semiconductor element joined with the lead frame. The lead frame includes a first joining structure and a second joining structure. The first joining structure includes a void part as a part at which the lead frame does not exist, and the second joining structure includes a void part as a part at which the lead frame does not exist. Each of the first joining structure and the second joining structure has a shape such that one of the first joining structure and the second joining structure complements at least part of the void part of the other assuming that the first joining structure and the second joining structure are overlapped.

Semiconductor module and semiconductor device

An object of the present invention is to provide a semiconductor device capable of reducing external stress transmitted to a semiconductor chip through a lead frame. A semiconductor device includes a base plate, a semiconductor element held on the base plate, a housing disposed on the base plate and having a frame shape enclosing the semiconductor element, a terminal section provided in an outer surface of the housing and connectable to an external device, a lead frame that is long and has one end disposed so as to be connectable to the terminal section provided in the housing and another end connected onto the semiconductor element via a bonding material, a sealing material disposed in the housing to seal the lead frame and the semiconductor element, and a fixing section that fixes, in the housing, part of the lead frame to the base plate or the housing.

Semiconductor device, control device, and method for manufacturing semiconductor device

The present invention relates to a semiconductor device module which includes: a semiconductor device including a top electrode and a bottom electrode; a substrate on which the bottom electrode of the semiconductor device is bonded; a heat sink on which the substrate is mounted; a lead electrode through which a main current of the semiconductor device flows; an insulating case disposed to enclose the substrate; and a retainer disposed in a cantilevered manner in the insulating case, the retainer supporting the lead electrode, wherein the lead electrode has one end brazed to the top electrode of the semiconductor device, and another end side inserted into a wall of the insulating case, and the retainer is engaged on the one end of the lead electrode to restrict movement of the lead electrode.

Semiconductor device module

A semiconductor device of the present invention includes a semiconductor element having an upper surface and a lower surface, a metal plate thermally connected to the lower surface, an upper surface electrode soldered to the upper surface, an insulating sheet formed on the upper surface electrode so as to be in surface contact with the upper surface electrode, a shielding plate formed on the insulating sheet so as to be in surface contact with the insulating sheet, the shielding plate shielding against radiation noise, and a resin with which the semiconductor element is covered, while a portion of the upper surface electrode, a portion of the shielding plate and a lower surface of the metal plate are exposed to the outside, wherein the heat conductivity of the insulating sheet is higher than the heat conductivity of the resin.

A semiconductor module includes first and second semiconductor elements connected in series, an insulating substrate, first and second metal patterns formed on a first main surface and a second main surface of the insulating substrate, and first, second, and third electrode plates. A lower surface electrode and an upper surface electrode of the first semiconductor element are bonded to the first metal pattern and the first electrode plate, respectively. The first metal pattern and the third electrode plate are bonded together. An upper surface electrode of the second semiconductor element is bonded to the third electrode plate. A lower surface electrode of the second semiconductor element is electrically connected to the second metal pattern. The second metal pattern and the second electrode plate are bonded together. One end of the first electrode plate and one end of the second electrode plate are led out on the same side.

Growing community of inventors

Tokyo, Japan

Arata Iizuka