Other

Sony Electronics Inc

Sony Corporation

Toko, Inc.

Revtek Inc.

Aram A Tanielian

Michael J Kohut

Paul Nigel Wood

Dana B Wood

Leroy Reese

George Carlsen

Mark Waring

Garo W Tanielian

Jeff Taylor

Jaye M Waas

James J Licari

George D Carlsen, Ii

Keiichi Nakanishi

W Edward Naugler, Jr

Nikolay N Kiryuhin

Andrey Ya Chervonenkis

Vladimir L Gribkov

Alexey L Solodov

A low profile high power Schottky barrier bypass diode for solar cells and panels with the cathode and anode electrodes on the same side of the diode and a method of fabrication thereof are disclosed for generating a thin chip with both electrodes being on the same side of the chip. In an embodiment, a mesa isolation with a Zener diode over the annular region surrounding the central region of the mesa anode in the Epi of the substrate is formed. In an embodiment, a P-type Boron dopant layer is ion implanted in the annular region for the Zener Diode. This controls recovery from high voltage spikes from the diode rated voltage. A Schottky barrier contact for the anode and a contact for the cathode are simultaneously created on the same side of the chip.

Low profile Schottky barrier diode for solar cells and solar panels and method of fabrication thereof

A plurality of individual circuits are formed on a substrate. Each of the individual circuits is formed with electrical contacts. A spacer is sealed onto the substrate, the spacer peripherally enclosing each of the individual circuits while exposing the conductive contacts. A cover is positioned over the spacer is and integral with it. First conductive feedthroughs penetrate the cover, the first conductive feedthroughs positioned peripheral to each of the individual circuits. Conductive pads are formed on a bottom surface of the cover, the conductive pads in electrical continuity with the conductive contacts of the individual circuits. Conductive paths are formed on the bottom surface of the cover, the conductive paths each joining at least one of the conductive pads with at least one of the first conductive feedthroughs thereby establishing electrical continuity between the individual circuits and the first conductive feedthroughs so as to establish pin-outs.

Large scale simultaneous circuit encapsulating apparatus

A magnetooptic device to be used in industrial applications to investigate articles for flaws or defects. The magnetooptic device is capable of revealing defects in articles of nonmagnetic and magnetic conducting material. These results are achieved by designing a magnetooptic device having a magnetooptic transformer element on its bottom surface and incorporating a front electrical contact and a rear electrical contact on the bottom surface of the MO device. The respective electrical contacts are connected by wire conductors to the respective positive and negative terminals of a source of electrical current. The defect pattern of an article can be either visually viewed or the defect pattern can be recorded on a tape or magnetic rubber sheet placed between the bottom surface of the MO device and the top surface of the article being analyzed.

Magnetooptic system for article defects and flaws detection

A photosensitive medium, such as motion picture film, having digital audio signals photographically recorded thereon. If the medium has multiple, spatially separated digital and analog audio soundtracks, a photosensitive detector array is employed for each of the digital audio soundtrack areas, and a separate analog soundtrack read head is employed. Preferably, digital error code is recorded in a digital soundtrack area of the medium (with digital audio bits), and error detection and correction are performed on the recorded digital audio bits read from the medium. Preferably, the apparatus includes switching circuitry for substituting a corresponding analog audio signal for one or more corrupted digital soundtrack channels, when such digital soundtrack channels have an error rate which exceeds a selected threshold. Also preferably, the invention reads recorded digital audio information by projecting a laser beam (having a near infrared wavelength) on a row of a digital soundtrack area of a motion picture film, to modulate the beam as it passes through the row. The radiation transmitted through each digital soundtrack bit area is projected onto a spot in the detector plane that is substantially larger than the dimension of each individual detector which receives the spot. As the film translates continuously relative to the radiation source so that the projection of the spot translates relative to each receiving detector, the output of each receiving detector is integrated over the period during which a portion of the spot is projected thereon.

Medium having photographically recorded digital audio bits

Seepage of water and other impurities into hermetically sealed on plastic encapsulated modules leads to eventual device failure, as conductor material corrodes and opens, or electromigrates to establish conductive trails across a substrate, shorting the conductors. To forewarn of such failure, a sensing device defined as a separate chip is packaged in the same module with the circuit to be checked, with pinouts that can be tested with a circuit that is usually external. The sensor makes use of the moisture-induced migratory behavior that causes the problem, using a highly migratory metal or alloy to define paired electrodes spaced as closely as 2 micrometers apart. The metal of the electrodes undergoes rapid ionization and migration in the presence of trace amounts of moisture, dissolved ionic contaminants, and a small potential difference across the electrodes. Two volts applied to the sensor conductors by the sensor circuit will output a voltage if even a minute current is flowing between the electrodes permitting 'go/no-go' decisions to be made regarding use of the module. The moisture which actuates the sensor, triggers the circuit long before the level of seepage and electromigratic represents present danger of circuit failure, and long before other types of sensors would indicate the existence of a problem.

Moisture sensor for electronic modules

A thin transparent epitaxial layer of a magnetizable material (e.g. gallium ferrite) is deposited on a substrate of a dielectric transparent material (e.g. gadolinium gallium garnet). A mask made from an oxidizable material (e.g. silicon) deposited on the epitaxial layer covers pixels defining rows and columns and exposes the other areas on the epitaxial layer. The epitaxial layer is then annealed at a suitable temperature (e.g. 500.degree. C.) for a suitable time (e.g. 10 minutes) to oxidize the silicon and reduce the Fe atoms in the pixel areas beneath the mask to Fe.sup.++ ions. This causes the pixel areas beneath the mask to be more easily magnetizable than the other areas in the epitaxial layer. The mask is then removed and a first insulating layer is deposited on the epitaxial layer. A first plurality of windings is then deposited on the first insulated layer in insulating relationship to one another. Each winding extends in a sinuous path in three (3) directions, two (2) oppositely disposed, magnetically coupled to each pixel in an individual one of the columns. A second insulating layer is then deposited on the first windings. A second plurality of windings is then deposited on the second insulating layer in the same relationship to the pixels in the rows as the relationship of the first windings to the pixels in the columns. A pixel common to an individual winding in the first plurality and to an individual winding in the second plurality is then magnetized in accordance with the current magnitudes in the two (2) windings.

Magneto-optical display and method of forming such display

A method and apparatus for photographically recording digital audio signals, and a medium having digital audio signals photographically recorded thereon. In a preferred embodiment, a motion picture film recorded in accordance with the invention has multiple digital audio soundtracks and an analog audio soundtrack photographically recorded thereon. Two or more channels of digital audio information can be recorded in each digital soundtrack, along with additional digital information for clocking, tracking, and error detection and correction. Each digital soundtrack is recorded in an array of bit areas arranged in row and column order. In a class of preferred embodiments, each row of digital audio bits is recorded simultaneously by exposing the film to radiation that has been modulated by a linear shutter array. The radiation transmitted by each shutter array is projected onto a row of spots. Each spot covers the full width of one of the bit areas in a row, but only part of the length of the bit area. As the medium is translated continuously (lengthwise) relative to the projected spots, each of the spots sweeps across a bit area, thereby recording a bit in the bit area which it sweeps in a manner analogous to painting the bit area with a paint brush.

Method and apparatus for photographically recording digital audio and a

A method and apparatus for reading digital audio signals photographically recorded on a medium (such as motion picture film). If the medium has multiple, spatially separated digital and analog audio soundtracks, a photosensitive detector array is employed for each of the digital audio soundtrack areas, and a separate analog soundtrack read head is employed. Preferably, digital error code is recorded in a digital soundtrack area of the medium (with digital audio bits), and error detection and correction are performed on the recorded digital audio bits read from the medium. Preferably, the apparatus includes switching circuitry for substituting a corresponding analog audio signal for one or more corrupted digital soundtrack channels, when such digital soundtrack channels have an error rate which exceeds a selected threshold. Also preferably, the invention reads recorded digital audio information by projecting a laser beam (having a near infrared wavelength) on a row of a digital soundtrack area of a motion picture film, to modulate the beam as it passes through the row. The radiation transmitted through each digital soundtrack bit area is projected onto a spot in the detector plane that is substantially larger than the dimension of each individual detector which receives the spot. As the film translates continuously relative to the radiation source so that the projection of the spot translates relative to each receiving detector, the output of each receiving detector is integrated over the period during which a portion of the spot is projected thereon.

Method and apparatus for reading photographically recorded digital audio

A plurality of semi-conductor diodes disposed in an array may be constructed to emit light when subjected to a particular voltage. This voltage reversely biases the semi-conductor diodes to break down the semi-conductor diodes and to provide for the emission of light upon breakdown. The breakdown occurs at the junction between a pair of electrodes in each semi-conductor diode. One of the electrodes may be an n electrode and the other electrode may be a p electrode. To break down the diode, a positive voltage (e.g. 3-5 volts) may be applied to the n electrode and a ground voltage may be applied to the p electrode. The diodes are so small that an array of 1024.times.1024 diodes can be disposed in a space approximately 0.4' square to act as pixels. The diodes may be scanned, as in a raster scan, preferably on a repetitive basis. During such scan, individual ones of the diodes receive the breakdown voltage in representation of a visual image to provide a visual display of the image in the pixels defined by the diodes. The emitted light for each pixel is visible at the junction between the p electrode and the n electrode in the diode representing such pixel. The n electrode may be shaped, as in a tear drop, to facilitate the production of the light at such junction, which may be at the pointed end of the tear drop. The light may be formed by the emission of photons when electrons are momentarily trapped in an oxide layer above the junction and then fall back to ground.

Growing community of inventors

Rancho Palos Verdes, CA, United States of America

Aram A Tanielian