Sandisk 3D LLC

Lumileds LLC

Koninklijke Philips Corporation N.v.

Intermolecular, Inc.

Sandisk Corporation

Anchor Science LLC

Roitman, Daniel

Van Leth, Niek

Schricker, April

April Dawn Schricker

Mark Harold Clark

Brad Herner

Kim Kevin Mai

Tony P Chiang

Prashant B Phatak

Tanmay Kumar

Michael A Miller

Hans-Helmut Bechtel

Oleg Borisovich Shchekin

Michael Konevecki

Uwe Mackens

Joost Peter Andre Vogels

Andy Fu

Deepak Chandra Sekar

Peter Josef Schmidt

Daniel Bernardo Roitman

S Brad Herner

Grigoriy Basin

Huiwen Xu

Xiying Chen

Jingyan Zhang

Han Ho Choi

Raghuveer S Makala

Er-Xuan Ping

Klaus Florian Schuegraf

Xiying Costa

Brendan Jude Moran

Steven Patrick Maxwell

Aldegonda Lucia Weijers

Matthias Heidemann

Thomas Diederich

Yubao Li

Niek Van Leth

Utthaman Thirunavukkarasu

Xiyang Chen

Karl Adriaan Zijtveld

Depak C Sekar

Roy E Scheuerlein

Michael L Chan

Wipul Jayasekara

Alper Ilkbahar

Wu-Yi Henry Chien

Kenneth John Vampola

Kun Hou

Yibo Nian

Ewa Stanislawa Kirkor

Nicolaas Joseph Martin Van Leth

Guido Salmaso

Erik Nelson

Michael W Konevecki

A method includes mounting a ceramic phosphor on an acrylic-free and metal-containing catalyst-free tacky layer of a dicing tape, dicing the ceramic phosphor from the dicing tape into ceramic phosphor plates, removing the ceramic phosphor plates from the dicing tape, and attaching the ceramic phosphor plates on light-emitting device (LED) dies.

Method for attaching ceramic phosphor plates on light-emitting device (LED) dies using a dicing tape, method to form a dicing tape, and dicing tape

Embodiments of the invention include a light emitting device including a substrate and a semiconductor structure including a light emitting layer. A first reflective layer surrounds the light emitting device. A wavelength converting element is disposed over the light emitting device. A second reflective layer is disposed adjacent a first sidewall of the wavelength converting element.

Light emitting device with reflective sidewall

Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication.

LED fabrication using high-refractive-index adhesives

In embodiments of the invention, a light emitting device includes a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A first wavelength converting layer is disposed in a path of light emitted by the light emitting layer. The first wavelength converting layer may be a wavelength converting ceramic. A second wavelength converting layer is fused to the first wavelength converting layer. The second wavelength converting layer may be a wavelength converting material disposed in glass.

Wavelength converted semiconductor light emitting device

A method includes mounting a ceramic phosphor () on an acrylic-free and metal-containing catalyst-free tacky layer () of a dicing tape (), dicing the ceramic phosphor () from the dicing tape () into ceramic phosphor plates (), removing the ceramic phosphor plates () from the dicing tape (), and attaching the ceramic phosphor plates () on light-emitting device (LED) dies.

A ceramic green wavelength conversion element () is coated with a red wavelength conversion material () and placed above a blue light emitting element () such that the ceramic element () is attached to the light emitting element (), thereby providing an efficient thermal coupling from the red and green converters () to the light emitting element () and its associated heat sink. To protect the red converter coating () from the effects of subsequent processes, a sacrificial clear coating () is created above the red converter element (). This clear coating () may be provided as a discrete layer of clear material, or it may be produced by allowing the red converters to settle to the bottom of its suspension material, thereby forming a converter-free upper layer that can be subjected to the subsequent fabrication processes.

LED with ceramic green phosphor and protected red phosphor layer

A device according to embodiments of the invention includes a first semiconductor light emitting layer disposed between a first n-type region and a first p-type region. A second semiconductor light emitting layer disposed between a second n-type region and a second p-type region is disposed over the first semiconductor light emitting layer. A non-III-nitride material separates the first and second light emitting layers.

Device with multiple, stacked light emitting devices

A method according to embodiments of the invention includes providing a plurality of LEDs attached to a mount. A filter is attached to at least one of the plurality of LEDs. A protective layer is formed over the filter. A reflective layer is formed over the mount. A portion of the reflective layer disposed over the protective layer is removed.

Light emitting device including a filter and a protective layer

A method according to embodiments of the invention includes disposing a support layer () on a surface of a wavelength converting ceramic wafer (). The wavelength converting ceramic wafer and the support layer are diced () to form wavelength converting members. A wavelength converting member is attached to a light emitting device. After attaching the wavelength converting member to the light emitting device, the support layer is removed.

Method of forming a wavelength converted light emitting device

A method according to embodiments of the invention includes providing a plurality of LEDs () attached to a mount (). A filter () is attached to at least one of the plurality of LEDs. A protective layer () is formed over the filter. A reflective layer () is formed over the mount. A portion of the reflective layer disposed over the protective layer is removed.

A structure according to embodiments of the invention includes a plurality of LEDs attached to a mount. A wavelength converting layer is disposed over the LEDs. A transparent layer is disposed over the wavelength converting layer. Reflective material is disposed between neighboring LEDs.

Wavelength converted light emitting device

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Palo Alto, CA, United States of America

April Dawn Schricker