Infineon Technologies Ag

April Coleen Tuazon Bernardez

Chau Fatt Chiang

Kok Yau Chua

Stefan Helmut Schmalzl

Werner Josef Reiss

Chee Hong Lee

Soon Lee Liew

Hock Heng Chong

Nurfarena Othman

Hsieh Ting Kuek

Pei Luan Pok

Roslie Saini Bin Bakar

Kon Hoe Chin

Junny Abdul Wahid

Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.

Semiconductor package with air cavity

Growing community of inventors

Melaka, Malaysia

April Coleen Tuazon Bernardez