Micron Technology Incorporated

Aparna U Limaye

Owen R Fay

Tomoko Ogura Iwasaki

Randon K Richards

Avani F Trivedi

Tracy D Evans

Dong Soon Lim

Jianmin Huang

Debra M Bell

Diana C Majerus

Shea M Morrison

Rachael R Carlson

Timothy Mowry Hollis

Carla L Christensen

Bret K Street

David K Ovard

Chan H Yoo

Shijian Luo

Eiichi Nakano

Kathryn H Russo

M Ataul Karim

Gurtaranjit Kaur

Brandi M Jones

Cipriana Forgy

Lindsay Hamilton

Methods, systems, and devices for crosstalk cancellation for signal lines are described. In some examples, a device (e.g., a host device or a memory device) may generate a first signal and may invert the first signal to obtain an inverted first signal. The device may obtain a second signal based on attenuating a first range of frequencies of the inverted first signal and a second range of frequencies of the inverted first signal, where the first range of frequencies is below a first threshold frequency and the second range of frequencies is above a second threshold frequency that is greater than the first threshold frequency. The device may transmit the first signal via a first signal line of a set of signal lines and the second signal line via a second signal line of the set of signal lines.

Crosstalk cancellation for signal lines

Apparatuses and methods related to memory authentication. Memory devices can be authenticated utilizing authentication codes. An authentication code can be generated based on information stored in a fuse array of the memory device. The authentication code can be stored in the memory device. The stored authentication code can be compared to a captured authentication code based on fuse array information broadcast to memory components of the memory device. The authenticity of the memory device can be determined based on the comparison and can result in placing the memory device in an unlocked state.

Memory authentication

Methods and apparatuses associated with updating a map using images are described. An apparatus can include a processing resource and a memory resource having instructions executable to a processing resource to monitor a map including a plurality of locations, receive, at the processing resource, the memory resource, or both, and from a first source, image data associated with a first location, identify the image data as being associated with a missing portion, an outdated portion, or both, of the map, and update the missing portion, the outdated portion, or both, of the map with the image data.

Map update using images

Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device comprising an active surface having bond pads operably coupled to conductive traces extending over a dielectric material to via locations beyond at least one side of the stack, and vias extending through the dielectric materials at the via locations and comprising conductive material in contact with at least some of the conductive traces of each of the two or more electronic devices and extending to exposed conductors of the substrate. Methods of fabrication and related electronic systems are also disclosed.

Methods of forming microelectronic device assemblies and packages

Semiconductor devices with antennas and electromagnetic interference (EMI) shielding, and associated systems and methods, are described herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a package substrate. An antenna structure is disposed over and/or adjacent the semiconductor die. An electromagnetic interference (EMI) shield is disposed between the semiconductor die and the antenna structure to shield at least the semiconductor die from electromagnetic radiation generated by the antenna structure and/or to shield the antenna structure from interference generated by the semiconductor die. A first dielectric material and/or a thermal interface material can be positioned between the semiconductor die and the EMI shield, and a second dielectric material can be positioned between the EMI shield and the antenna structure. In some embodiments, the semiconductor device includes a package molding over at least a portion of the antenna, the EMI shield, and/or the second dielectric material.

Semiconductor packages and associated methods with antennas and EMI isolation shields

In some implementations, a device associated with a vehicle may receive, based on user input to an interface of the vehicle, information indicating an incident associated with the vehicle, wherein the user input indicates at least one of: whether the incident is associated with the user of the vehicle, or whether the incident is associated with an event outside of the vehicle. The device may transmit, to a system and via a transceiver of the vehicle, a message indicating the incident associated with the vehicle. The device may receive, from the system and via the transceiver of the vehicle, an acknowledgement of the message, wherein the acknowledgement indicates a classification of the incident. The device may cause the vehicle to perform one or more actions based on the incident associated with the vehicle and based on the classification of the incident.

Vehicle-to-everything (V2X) communication based on user input

Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.

Microelectronic device assemblies and packages including multiple device stacks and related methods

Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.

Methods of forming stacked semiconductors die assemblies

Apparatuses and methods related to detecting synchronization between multiple devices. The security of a device may be compromised if the device receives commands from unauthorized sources. A state of a device can be affected by the commands the device receives. A different device can determine whether there is synchronicity between device and the different device to determine whether the security of the device may have been compromised.

Device intrusion detection via variable code comparison

Systems and methods for read operations and management are disclosed. More specifically, this disclosure is directed to receiving a first read command directed to a first logical address and receiving, after the first read command, a second read command directed to a second logic address. The method also includes receiving, after the second read command, a third read command directed to a third logical address and determining that the first logical address and the third logical address correspond to a first physical address and a third physical address, respectively. The first physical address and the third physical address can be associated with a first word line of a memory component while the second logical address corresponds to a second physical address associated with a second word line of the memory component. The method includes executing the first read command and the third read command sequentially.

Sequential SLC read optimization

Systems, apparatuses, and methods related to media management, including 'garbage collection,' in memory or storage systems or sub-systems, such as solid state drives, are described. For example, a battery state associated with the memory system or sub-system may be used as an indicator or basis for managing a garbage collection operation on a data block. A controller or the system or sub-system may determine that a battery state or condition satisfies a criterion. Based on determining that the criterion is satisfied the, the garbage collection operation may be postponed until the battery state changes to satisfy a different battery condition.

Garbage collection in a memory sub-system during a low battery state

Systems, apparatuses, and methods related to media management, including 'garbage collection,' in memory or storage systems or sub-systems, such as solid state drives, are described. For example, a signaling can be received that indicates a request from a controller to migrate valid data from a first data block to a second data block. For example, the first data block can be a data block of a plurality of memory cells configured as single-level-cell (SLC) memory. The second data block can be configured as multi-level-cell (MLC) memory. The data migration operation can include an error control operation that is performed using the memory component, the error control operation excluding transferring the data to the controller. The data can be migrated from the first data block configured as SLC memory to the second data block configured as MLC memory after the error control operation is performed using the memory component.

Performing error control operation on memory component for garbage collection

Systems, apparatuses, and methods related to media management, including 'garbage collection,' in memory or storage systems or sub-systems, such as solid state drives, are described. For example, a criticality value can be determined and used as a basis for managing a garbage collection operation on a data block. A controller or the system or sub-system may determine that a criticality value associated with performing a garbage collection operation satisfies a condition. Based on determining that the condition is satisfied, a parameter associated with performing the garbage collection operation can be adjusted. The garbage collection operation is performed on the data block stored on the memory component using the adjusted parameter.

Growing community of inventors

Boise, ID, United States of America

Aparna U Limaye