International Business Machines Corporation

Globalfoundries Inc.

Aparna Prabhakar

S Jay Chey

John Ulrich Knickerbocker

Michael A Gaynes

Bing Dang

Cornelia K Tsang

Robert E Trzcinski

Dustin M Fregeau

Donna S Zupanski-Nielsen

Mohammed S Shaikh

Pavan Samudrala

Michael S Gordon

Theodore Gerard Van Kessel

Yves Corfield Martin

Brent A Wacaser

Nancy C LaBianca

Matthew J Farinelli

Peter Jerome Sorce

Frances Mary Ross

Kenneth F Latzko

Jay E Pogemiller

Ranjani Sirdeshmukh

Mark Den Heijer

An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

High performance compliant wafer test probe

A substrate has a top side and a bottom side. A solar cell is secured to the top side of the substrate and has an anode and a cathode. A heat transfer element is secured to the bottom side of the substrate. An anode pad is formed on the top side of the substrate and is coupled to the anode of the solar cell; similarly, a cathode pad is formed on the top side of the substrate and is coupled to the cathode of the solar cell. The substrate coefficient of thermal expansion and the solar cell coefficient of thermal expansion match within plus or minus ten parts per million per degree C.

Structure and design of concentrator solar cell assembly receiver substrate

An electrochemical cell apparatus is disclosed where the cell has a chamber for containing an electrolyte. The chamber is situated between a bottom and a top substrate. One or more bottom windows are in the bottom substrate and one or more top windows are in the top substrate. Each window has a window cover facing the chamber. The top window and bottom window each have a portion in alignment so that an electron beam passes through both respective portions. A spacer is deposited between the top and bottom substrate and forming walls surrounding the chamber. Two or more electrodes, each having an interior portion that is within the chamber and electrically continuous with an exterior portion external to the chamber, are located on the chamber side of the bottom substrate.

Electrochemical liquid cell apparatus

A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.

Laser ablation of adhesive for integrated circuit fabrication

A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.

Laser ablation for integrated circuit fabrication

A method for detecting soft errors in an integrated circuit (IC) due to transient-particle emission, the IC comprising at least one chip and a substrate includes mixing an epoxy with a radioactive source to form a hot underfill (HUF); underfilling the chip with the HUF; sealing the underfilled chip; measuring a radioactivity of the HUF at an edge of the chip; measuring the radioactivity of the HUF on a test coupon; testing the IC for soft errors by determining a current radioactivity of the HUF at the time of testing based on the measured radioactivity; and after the expiration of a radioactive decay period of the radioactive source, using the IC in a computing device by a user.

SER testing for an IC chip using hot underfill

Growing community of inventors

North White Plains, NY, United States of America

Aparna Prabhakar