Flextronics Ap, LLC

Flex Ltd.

Future Wei Technologies, Inc.

Infineon Technologies Ag

Cree Gmbh

Cree Microwave, Inc.

Spectrian Corporation

Reme, L.l.c.

Huawei Technologies Co., Limited

Anwar Mohammed

Weifeng Liu

Murad Kurwa

Zhen Feng

David Geiger

Jesus A Tan

Zohair Mehkri

Gerald H Negley

John Adam Edmond

Peter Scott Andrews

David Beardsley Slater, Jr

Jayesh Bharathan

Mark Raffetto

William L Uy

Donald Fowlkes

Soon Ing Chew

Jie Lian

Alexander Komposch

Dennis Willie

Rui Niu

Dason Cheung

Fei Yu

Richard Loi

Christian Biederman

Michael Real

Benjamin Pain-Fong Law

E James Crescenzi, Jr

Jennifer Nguyen

Hector Rene Marin Hernandez

Haoyu Song

Vadim Gektin

Qi Deng

Dick Pang

Robert Pennings

Gervasio Mutarelli

Julius Chew

Dick Tak Shing Pang

Renzhe Zhao

Cao Wei

Christian Andrada

Ranilo Aranda

Jonas Sjoberg

David Slater

A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

Wave solder pallets for optimal solder flow and methods of manufacturing

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

A carrier assembly configured to facilitate manufacture of a printed circuit board assembly includes a bottom frame defining a generally rectangular configuration and having a length and a width. The bottom frame is adjustable to vary at least one of the length or the width thereof. The assembly further includes a core releasably positionable on the bottom frame and configured to support a circuit board thereon. A carrier assembly system includes the bottom frame and a plurality of cores.

Adjustable carrier with changeable core

An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.

Method of integrating an electronic module with conductive fabric

An In-Mold Electronics (IME) device and method of manufacturing the IME device introduce a stretchable substrate laminated to a thermoplastic layer. The stretchable substrate has a screen printable surface for receiving printed conductive interconnects. This combination enables formation of an IME device with conductive interconnects oriented for hard to reach cavities and areas. The IME device eliminates the need to have additional mold features to enable deeper drawn cavities.

System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and features

An electronic sensor device has one or more sensor electrodes and one or more electrical conductors printed on a substrate. Textile layers are attached on either side of the substrate with access to the electrical conductors provided by a conductive snap assembly. The substrate can be a TPU (thermoplastic polyurethane) film. The sensor can be a biosensor, and the biosensor is attached to a compression textile, such as a compression shirt, and electrically interconnected using printed conductive ink interconnects to a conductive snap button.

Integrating biosensor to compression shirt textile and interconnect method

A method of manufacturing a part includes printing a layer of 3D printable material, positioning a layer of interlay material on the layer of 3D printable material, and printing another layer of 3D printable material on the layer of interlay material. A manufactured part includes a base layer of 3D printable material and a plurality of pairs of alternating layers disposed on the base layer of 3D printable material. Each pair of the plurality of pairs includes a layer of interlay material and another layer of 3D printable material printed on the layer of interlay material. The layers of interlay material provide at least one property to the manufactured part not provided by the layers of 3D printable material.

Method of manufacturing a part

Method of manufacturing a wave solder pallet

An electronic pressure sensor array has a plurality of conductive electrodes and interconnects selectively formed on a pressure sensor substrate to form a plurality of individual pressure sensor assemblies. The individual pressure sensor assemblies can be aligned in various configurations to form the electronic pressure sensor array. Each pressure sensor assembly is made of a plurality of layers including a pressure sensor substrate, insulating layers on either side of the pressure sensor substrate, and conductive ink layers on an outer surface of each insulating layer. A cavity is formed in each insulating layer, the cavity in one insulating layer being vertically aligned with the cavity in the other insulating layer, and conductive ink fills each cavity to form electrodes.

Pressure sensor array and the method of making

A conductive fabric includes a fabric with one or more electrically conductive wire braids woven into the fabric. The one or more wire braids are woven into the fabric such that one or more portions of each wire braid are exposed at one or more surfaces of the fabric, the exposed portions of the wire braid forming connection pads. Each connection pad provides an electrical connection point for attachment to a complementary electrical connection point on an electronic component, such as a bond pad, solder bump, or connection lead. A single wire braid can be used to electrically interconnect multiple electronic components. Multiple wire braids can be arranged, with appropriate spacing and alignment of exposed portions, to electrically interconnect multiple electronic components with multiple electrical interconnects between one or more electronic components. Each electrically conductive wire braid includes a plurality of individual electrically conductive wires braided together.

Fabric with woven wire braid

Methods of and devices for coupling metal woven mesh or metal woven fabric with IC components to make flexible circuits are disclosed. The flexible circuits can be used to make wearable electronic devices, such as a garment with embedded IC chip.

Component attach on metal woven mesh

An electroluminescent display is flexible and stretchable, and therefore able to be attached to a textile. All interior layers of the electroluminescent display can be made using a screen printing process which can be scaled for volume production.

Electroluminescent display on smart textile and interconnect methods

A flexible and stretchable chain battery includes multiple individual batteries connected in parallel and/or in series via stretchable conductive interconnects. The positive terminals of each battery are connected to a first stretchable conductive interconnect and the negative terminals of each battery are connected to a second stretchable conductive interconnect. The stretchable conductive interconnects and the batteries are coupled to a stretchable substrate. The stretchable conductive interconnects provide electrical interconnection between the multiple batteries while enabling stretchability between the batteries.

Flexible and stretchable chain battery

A method and apparatus for forming a circuit on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface of an object is described. An amount of electrically conductive material to form a circuit between two points on the object is determined. The determined amount of electrically conductive material is deposited on a first surface of a stretchable substrate. The stretchable substrate with the deposited electrically conductive material is applied to the object to form a circuit between two points on the object.

Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces

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San Jose, CA, United States of America

Anwar Mohammed