Auradine, Inc.

Anuya Reddy

Lyle Looney

Darshan Shah

Pranav Kalyanraman

Larry Yu

A circuit board assembly is provided. The circuit board assembly includes a circuit board and a plurality of chips assembled on a surface of the circuit board. The plurality of chips include integrated circuit (IC) chips. At least two chips are positioned on the surface of the circuit board adjacent to one another with a spacing separating the two chips that is less than a minimum dimension of each of the two chips. A circuit board and a method for circuit board assembly are also provided.

Circuit board assembly having circuit board with adjacent chips immersed in dielectric liquid and method of making the same

Examples of devices for providing cooling solutions are described. One example device includes a substrate, one or more integrated circuit (IC) chips placed on the substrate, and a boilerplate including one or more rails. At least one rail of the one or more rails includes a recess in a surface of the at least one rail that faces the one or more IC chips. The recess includes outer walls contacting the one or more IC chips and forming a cavity for accommodating a thermal interface material (TIM) coupled to the one or more IC chips.

Systems and methods for cooling electronic circuits

Examples of devices for providing cooling solutions are described. One example device includes a boilerplate, a printed circuit board (PCB), one or more integrated circuit (IC) chips placed on the PCB, a thermal interface material (TIM), and one or more gaskets. The TIM is placed between the boilerplate and at least one IC chip of the one or more IC chips. The TIM is coupled to a surface of at least the IC chip that faces the boilerplate. The one or more gaskets are placed between the boilerplate and the PCB and encompassing the TIM. The one or more gaskets are configured to seal the at least one IC chip to provide a protective barrier for the TIM.

Examples of devices for providing cooling solutions are described. One example device at least one printed circuit board (PCB) and at least one baffle cover positioned along an edge of the at least one PCB. The at least one PCB is immersed in a cooling fluid in a tank. The at least one PCB includes one or more integrated circuit (IC) chips with a thermal interface material (TIM) applied to surfaces of the one or more IC chips that are coupled to a boilerplate. The baffle cover includes one or more openings that are configured to control an agitation of the cooling fluid proximate to the edge of the at least one PCB.

Baffles for electronic circuits immersed in cooling fluid in a tank

A circuit board assembly is provided. The circuit board assembly includes a circuit board and a plurality of chips assembled on a surface of the circuit board. The plurality of chips include integrated circuit (IC) chips. At least two chips are positioned on the surface of the circuit board adjacent to one another with a spacing separating the two chips that is less than a minimum dimension of each of the two chips. A method for circuit board assembly is also provided.

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Pleasanton, CA, United States of America

Anuya Reddy